Datasheet EPC2361 (Efficient Power Conversion) - 8

HerstellerEfficient Power Conversion
BeschreibungEnhancement Mode Power Transistor
Seiten / Seite10 / 8 — eGaN® FET DATASHEET. TRANSPARENT VIEW. PIN. Description. RECOMMENDED. …
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eGaN® FET DATASHEET. TRANSPARENT VIEW. PIN. Description. RECOMMENDED. LAND PATTERN. 0.47 x 0.985. Part outline. Mask Opening. 0.47 x 3.4

eGaN® FET DATASHEET TRANSPARENT VIEW PIN Description RECOMMENDED LAND PATTERN 0.47 x 0.985 Part outline Mask Opening 0.47 x 3.4

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eGaN® FET DATASHEET
EPC2361
TRANSPARENT VIEW PIN Description 1 1
Gate
2
Source
3
Drain
3 4 5 6 7 4
Source
2 5
Drain
6
Source
7
Drain
RECOMMENDED LAND PATTERN 0.47 x 0.985
(units in mm) -2.7 -2.175 -1.275 -0.425 0 0.425 1.275 2.175 2.7 Legend:
Part outline
(x6)
Mask Opening
0.35 1.207 0.37 0.975 0.975 Radius = 0.05 Land pattern is solder mask defined 0.325 0.225 0 0 0.35 -0.325 -0.325 -0.663 -0.975 -0.975
0.47 x 3.4 0.47 x 2.1
0.37 x 3.4 (x4)
RECOMMENDED STENCIL DRAWING
(units in mm) 0.4 x 0.975 -2.64 -2.123 -1.275 -0.425 0 0.425 1.275 2.123 2.64 Legend:
Part outline Stencil opening
1.216 1.2 0.975 0.975 0.95 Recommended stencil should be 4 mil (100 µm) thick, must be laser cut, openings per drawing. 0.4 x 0.9 0.325 Intended for use with SAC305 Type 4 solder, 0.225 reference 88.5% metals content. 0 0 -0.05 The corner has a radius of R60. -0.325 -0.325 Split stencil design can be provided upon request, but EPC has tested this stencil design -0.975 -0.95 -0.975 and not found any scooping issues. -1.2 -1.2 0.275 x 0.37 (x8) 0.4 x 1.0 1.5 x 0.26 (x8) 0.4 x 1.0 (x3) EPC – POWER CONVERSION TECHNOLOGY LEADER | EPC-CO.COM | ©2024 | For more information:
info@epc-co.com
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