Datasheet TLV3201, TLV3202 (Texas Instruments) - 4

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TLV3201, TLV3202
SBOS561B – MARCH 2012 – REVISED DECEMBER 2016
www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage 7 Voltage V Signal input pins(2) –0.5 (VCC) + 0.5 Signal input pins(2) –10 10 Current mA Output short circuit(3) 100 Operating –55 125 Temperature Junction, T °C J 150 Storage, Tstg –65 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails must be current limited to 10 mA or less. (3) Short-circuit to ground.
7.2 ESD Ratings VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge TLV3201 ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) TLV3202 ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VS Supply voltage, VS = (VS+) – (VS–) 2.7 (±1.35) 5.5 (±2.75) V Specified temperature –40 125 °C
7.4 Thermal Information TLV3201 TLV3202 DBV DCK DGK D THERMAL METRIC(1) UNIT (SOT-23) (SC70) (VSSOP) (SOIC) 5 PINS 5 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 237.8 281.9 146.3 201.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 108.7 97.6 97.2 92.5 °C/W RθJB Junction-to-board thermal resistance 64.1 68.3 84.2 123.3 °C/W ψJT Junction-to-top characterization parameter 12.1 2.6 45.5 23 °C/W ψJB Junction-to-board characterization parameter 63.3 67.3 83.7 212.6 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 4 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated Product Folder Links: TLV3201 TLV3202 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Table 6 Pin Configuration and Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 ESD Ratings 7.3 Recommended Operating Conditions 7.4 Thermal Information 7.5 Electrical Characteristics: VCC = 5 V 7.6 Electrical Characteristics: VCC = 2.7 V 7.7 Switching Characteristics 7.8 Typical Characteristics 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Operating Voltage 8.3.2  Input Overvoltage Protection 8.4 Device Functional Modes 9 Application and Implementation 9.1 Application Information 9.1.1 Comparator Inputs 9.1.2 External Hysteresis 9.1.2.1 Inverting Comparator with Hysteresis 9.1.2.2 Noninverting Comparator With Hysteresis 9.1.3 Capacitive Loads 9.2 Typical Applications 9.2.1 TLV3201 Configured as an AC-Coupled Comparator 9.2.1.1 Design Requirements 9.2.1.2 Detailed Design Procedure 9.2.1.3 Application Curve 9.2.2 TLV3201 and OPA320 Configured as a Fast-Response Output Current Monitor 9.2.3 TLV3201 and TMP20 Configured as a Precision Analog Temperature Switch 10 Power Supply Recommendations 11 Layout 11.1 Layout Guidelines 11.2 Layout Example 12 Device and Documentation Support 12.1 Device Support 12.1.1 Development Support 12.1.1.1 TINA-TI™ (Free Software Download) 12.1.1.2 Universal Op Amp EVM 12.1.1.3 TI Precision Designs 12.1.1.4 WEBENCH Filter Designer 12.2 Documentation Support 12.2.1 Related Documentation 12.3 Related Links 12.4 Receiving Notification of Documentation Updates 12.5 Community Resource 12.6 Trademarks 12.7 Electrostatic Discharge Caution 12.8 Glossary 13 Mechanical, Packaging, and Orderable Information