Datasheet CPC1004N (Littelfuse) - 5

INTEGRATED CIRCUITS DIVISION
CPC1004N Manufacturing Information Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard,
IPC/JEDEC J-STD-020
, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a
Moisture Sensitivity Level (MSL)
classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033
.
Device Moisture Sensitivity Level (MSL) Classifi cation
CPC1004N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625
.
Soldering Profile
Provided in the table below is the
IPC/JEDEC J-STD-020
Classification Temperature (T ) and the maximum C dwell time the body temperature of these surface mount devices may be (T - 5)°C or greater. The Classification C Temperature sets the Maximum Body Temperature allowed for these devices during reflow soldering processes.
Device Classifi cation Temperature (T ) Dwell Time (t ) Max Refl ow Cycles c P
CPC1004N 260ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. R10
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