Datasheet MPM (Vishay) - 2
| Hersteller | Vishay |
| Beschreibung | Molded, SOT-23 Thin Film Resistor, Surface Mount Divider Network |
| Seiten / Seite | 4 / 2 — MPM (Divider). STANDARD ELECTRICAL SPECIFICATIONS TEST. SPECIFICATIONS. … |
| Dateiformat / Größe | PDF / 108 Kb |
| Dokumentensprache | Englisch |
MPM (Divider). STANDARD ELECTRICAL SPECIFICATIONS TEST. SPECIFICATIONS. CONDITIONS. Material. Pin/Lead Number. Resistance Range
Modelllinie für dieses Datenblatt
Textversion des Dokuments
MPM (Divider)
www.vishay.com Vishay Dale Thin Film
STANDARD ELECTRICAL SPECIFICATIONS TEST SPECIFICATIONS CONDITIONS Material
Passivated nichrome -
Pin/Lead Number
3 -
Resistance Range
250 Ω to 100 kΩ per resistor -
Resistance for Jumper
≤ 50 mΩ -
TCR: Absolute
± 25 ppm/°C -55 °C to +125 °C
TCR: Tracking
± 2 ppm/°C (typical) -55 °C to +125 °C
Tolerance: Absolute
± 0.05 % to ± 1.0 % +25 °C
Tolerance: Ratio
± 0.01 % to 0.5 % +25 °C
Power Rating: Resistor
100 mW Maximum at +70 °C
Power Rating: Package
200 mW Maximum at +70 °C
Stability: Absolute
ΔR ± 0.05 % 2000 h at +70 °C
Stability: Ratio
ΔR ± 0.015 % 2000 h at +70 °C
Voltage Coefficient
0.1 ppm/V -
Working Voltage
100 V max. not to exceed P x R -
Operating Temperature Range
-55 °C to +125 °C -
Storage Temperature Range
-55 °C to +150 °C -
Noise
< -30 dB -
Thermal EMF
0.2 μV/°C -
Shelf Life Stability: Absolute
ΔR ± 0.01 % 1 year at +25 °C
Shelf Life Stability: Ratio
ΔR ± 0.002 % 1 year at +25 °C
Note
• TCR and TCR tracking are not available for parts with zero ohm jumpers
DIMENSIONS AND IMPRINTING
in inches and millimeters
INCHES MILLIMETERS DIMENSION MIN. MAX. MIN. MAX. 3
A 0.031 0.040 0.79 1.02 W A1 0.001 0.004 0.02 0.10 B 0.105 0.120 2.67 3.05 B T S 0.071 0.079 1.80 2.00 W 0.015 0.021 0.38 0.54 A H L L 0.083 0.098 2.10 2.50 H 0.047 0.055 1.20 1.40 S A1 K J T 0.005 0.010 0.13 0.25
2 1
Pin # Ø J 0.0035 0.0059 0.089 0.15 K 0.017 0.022 0.44 0.55 Ø 0 8° 0 8°
MECHANICAL SPECIFICATIONS DERATING CURVE Resistive Element
Passivated nichrome 100 10000
Substrate Material
Silicon 100 % = 0.2 W
Body
Molded epoxy
Terminals
Copper alloy 80
Lead (Pb)-free Option
100 % matte tin ) 1000
Tin Lead Option
Sn85 r (% 60 e
Tin Lead and Lead (Pb)-free Finish
Plated e ne ine w lin o 1st li 2nd l 40 2nd ted P a 100 R 20 0 10 0 70 125 150 Ambient Temperature (°C) Revision: 03-Jan-2022
2
Document Number: 60001 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com Vishay Dale Thin Film
STANDARD ELECTRICAL SPECIFICATIONS TEST SPECIFICATIONS CONDITIONS Material
Passivated nichrome -
Pin/Lead Number
3 -
Resistance Range
250 Ω to 100 kΩ per resistor -
Resistance for Jumper
≤ 50 mΩ -
TCR: Absolute
± 25 ppm/°C -55 °C to +125 °C
TCR: Tracking
± 2 ppm/°C (typical) -55 °C to +125 °C
Tolerance: Absolute
± 0.05 % to ± 1.0 % +25 °C
Tolerance: Ratio
± 0.01 % to 0.5 % +25 °C
Power Rating: Resistor
100 mW Maximum at +70 °C
Power Rating: Package
200 mW Maximum at +70 °C
Stability: Absolute
ΔR ± 0.05 % 2000 h at +70 °C
Stability: Ratio
ΔR ± 0.015 % 2000 h at +70 °C
Voltage Coefficient
0.1 ppm/V -
Working Voltage
100 V max. not to exceed P x R -
Operating Temperature Range
-55 °C to +125 °C -
Storage Temperature Range
-55 °C to +150 °C -
Noise
< -30 dB -
Thermal EMF
0.2 μV/°C -
Shelf Life Stability: Absolute
ΔR ± 0.01 % 1 year at +25 °C
Shelf Life Stability: Ratio
ΔR ± 0.002 % 1 year at +25 °C
Note
• TCR and TCR tracking are not available for parts with zero ohm jumpers
DIMENSIONS AND IMPRINTING
in inches and millimeters
INCHES MILLIMETERS DIMENSION MIN. MAX. MIN. MAX. 3
A 0.031 0.040 0.79 1.02 W A1 0.001 0.004 0.02 0.10 B 0.105 0.120 2.67 3.05 B T S 0.071 0.079 1.80 2.00 W 0.015 0.021 0.38 0.54 A H L L 0.083 0.098 2.10 2.50 H 0.047 0.055 1.20 1.40 S A1 K J T 0.005 0.010 0.13 0.25
2 1
Pin # Ø J 0.0035 0.0059 0.089 0.15 K 0.017 0.022 0.44 0.55 Ø 0 8° 0 8°
MECHANICAL SPECIFICATIONS DERATING CURVE Resistive Element
Passivated nichrome 100 10000
Substrate Material
Silicon 100 % = 0.2 W
Body
Molded epoxy
Terminals
Copper alloy 80
Lead (Pb)-free Option
100 % matte tin ) 1000
Tin Lead Option
Sn85 r (% 60 e
Tin Lead and Lead (Pb)-free Finish
Plated e ne ine w lin o 1st li 2nd l 40 2nd ted P a 100 R 20 0 10 0 70 125 150 Ambient Temperature (°C) Revision: 03-Jan-2022
2
Document Number: 60001 For technical questions, contact: thinfilm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000