Datasheet 0ZAF (Bel) - 4
| Hersteller | Bel |
| Beschreibung | Surface Mount PTC |
| Seiten / Seite | 4 / 4 — Environmental Specifications. Solder Reflow and Rework Recommendations |
| Dateiformat / Größe | PDF / 569 Kb |
| Dokumentensprache | Englisch |
Environmental Specifications. Solder Reflow and Rework Recommendations
Modelllinie für dieses Datenblatt
Textversion des Dokuments
Type 0ZAF Series
4
/
4 Environmental Specifications
Temperature cycling JESD22 Method JA-104 Biased humidity MIL-STD-202 Method 103 Operational life MIL-STD-202 Method 108 Resistance to solvents MIL-STD-202 Method 215 Mechanical shock MIL-STD-202 Method 213 Vibration MIL-STD-202 Method 204 Resistance to soldering heat MIL-STD-202 Method 210 Thermal shock MIL-STD-202 Method 107 Solderability ANSI/J-STD-002 Board flex(SMD) AEC-Q200-005 Terminal strength AEC-Q200-006
Solder Reflow and Rework Recommendations
Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3° C/second max Preheat : Temperature Min (Tsmin) 150° C Temperature Max (Tsmax) 200° C Time (tsmin to tsmax) 60-180 seconds Time maintained above: Temperature(TL) 217° C Time (tL) 60-150 seconds Peak/Classification Temperature(Tp) : 260° C Time within 5° C of actual Peak : Temperature (tp) 20-40 seconds Ramp-Down Rate : 6° C/second max. Time 25° C to Peak Temperature : 8 minutes max Solder Reflow Due to “lead free / RoHS compliant ” construction of these PTC devices , the required Temperature and Dwell Time in the “ Soldering ” zone of the reflow profile are greater than those used for non-RoHS devices. 1. Recommended reflow methods; IR, vapor phase oven, hot air oven. 2. Not Recommended For Wave Solder / Direct Immersion. 3. Recommended paste thickness range – 0.20 – 0.25mm. 4. Devices are compatible with standard industry cleaning solvents and methods. 5. MSL: 2a (According to IPC J-Std-020). Caution If reflow temperature / dwell times exceed the recommended profile, the electrical performance of the PTC may be affected. Rework: MIL-STD-202G Method 210F, Test Condition A.
Standard Packaging P/N Explanation and Ordering Information
Part Number Tape/Reel Qty 0ZAF0005FF28 Thru 800 0ZAF0016FF28 800 fuses in 7 inches dia. Reel, 8mm wide tape, 4mm pitch, per EIA-481(equivalent IEC-286 part 3). Specifications subject to change without notice
Bel Fuse Inc.
+1 201.432.0463 206 Van Vorst Street Bel.US.CS@belf.com Jersey City, NJ 07302 USA
belfuse.com/circuit-protection
© 2023 Bel Fuse, Inc. Rev. 0ZAF May2023
4
/
4 Environmental Specifications
Temperature cycling JESD22 Method JA-104 Biased humidity MIL-STD-202 Method 103 Operational life MIL-STD-202 Method 108 Resistance to solvents MIL-STD-202 Method 215 Mechanical shock MIL-STD-202 Method 213 Vibration MIL-STD-202 Method 204 Resistance to soldering heat MIL-STD-202 Method 210 Thermal shock MIL-STD-202 Method 107 Solderability ANSI/J-STD-002 Board flex(SMD) AEC-Q200-005 Terminal strength AEC-Q200-006
Solder Reflow and Rework Recommendations
Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3° C/second max Preheat : Temperature Min (Tsmin) 150° C Temperature Max (Tsmax) 200° C Time (tsmin to tsmax) 60-180 seconds Time maintained above: Temperature(TL) 217° C Time (tL) 60-150 seconds Peak/Classification Temperature(Tp) : 260° C Time within 5° C of actual Peak : Temperature (tp) 20-40 seconds Ramp-Down Rate : 6° C/second max. Time 25° C to Peak Temperature : 8 minutes max Solder Reflow Due to “lead free / RoHS compliant ” construction of these PTC devices , the required Temperature and Dwell Time in the “ Soldering ” zone of the reflow profile are greater than those used for non-RoHS devices. 1. Recommended reflow methods; IR, vapor phase oven, hot air oven. 2. Not Recommended For Wave Solder / Direct Immersion. 3. Recommended paste thickness range – 0.20 – 0.25mm. 4. Devices are compatible with standard industry cleaning solvents and methods. 5. MSL: 2a (According to IPC J-Std-020). Caution If reflow temperature / dwell times exceed the recommended profile, the electrical performance of the PTC may be affected. Rework: MIL-STD-202G Method 210F, Test Condition A.
Standard Packaging P/N Explanation and Ordering Information
Part Number Tape/Reel Qty 0ZAF0005FF28 Thru 800 0ZAF0016FF28 800 fuses in 7 inches dia. Reel, 8mm wide tape, 4mm pitch, per EIA-481(equivalent IEC-286 part 3). Specifications subject to change without notice
Bel Fuse Inc.
+1 201.432.0463 206 Van Vorst Street Bel.US.CS@belf.com Jersey City, NJ 07302 USA
belfuse.com/circuit-protection
© 2023 Bel Fuse, Inc. Rev. 0ZAF May2023