Datasheet TLP3475W (Toshiba) - 6

TLP3475W 13. Soldering and Storage 13.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below. • When using soldering reflow (See the figure shown below, which is based on the package surface temperature.) Reflow soldering may be performed up to twice. The first reflow soldering should be performed within 168 hours after opening the moisture-proof packaging. The second reflow soldering must be performed within 168 hours of the first reflow. • • :: When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260 �, or within 3 seconds for lead temperature not exceeding 350 �. Heating by soldering iron(less than 150 W) must be done only once per lead. In the case of removal, please take care so that the land on the board does not exfoliate. In addition, Toshiba warrants neither for reusing of the removal package nor the soldering reliability of removal part. ©2022-2023 6 2023-08-24 Toshiba Electronic Devices & Storage Corporation Rev.1.0