Datasheet H11F1M, H11F2M, H11F3M (ON Semiconductor) - 6
| Hersteller | ON Semiconductor |
| Beschreibung | Photo FET Optocouplers |
| Seiten / Seite | 10 / 6 — H11F1M, H11F2M, H11F3M. REFLOW PROFILE. Profile Feature. Pb−Free Assembly … |
| Dateiformat / Größe | PDF / 341 Kb |
| Dokumentensprache | Englisch |
H11F1M, H11F2M, H11F3M. REFLOW PROFILE. Profile Feature. Pb−Free Assembly Profile. ORDERING INFORMATION. Option
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H11F1M, H11F2M, H11F3M REFLOW PROFILE
Max. Ramp−up Rate = 3°C/s TP Max. Ramp−down Rate = 6°C/s 260 tP 240 TL 220 200 Tsmax tL 180 Preheat Area (_C) 160 Tsmin 140 ts 120 Temperature 100 80 60 40 20 0 120 240 360 Time 25°C to Peak Time (s)
Profile Feature Pb−Free Assembly Profile
Temperature Min. (Tsmin) 150°C Temperature Max. (Tsmax) 200°C Time (t S) from (Tsmin to Tsmax) 60–120 seconds Ramp−up Rate (t L to tP ) 3°C/seconds max. Liquidous Temperature (TL) 217°C Time (t L) Maintained Above (TL) 60–150 seconds Peak Body Package Temperature 260°C +0°C / –5°C Time (t ) within 5 P °C of 260°C 30 seconds Ramp−down Rate (TP to TL) 6°C/seconds max. Time 25°C to Peak Temperature 8 minutes max.
ORDERING INFORMATION Option Order Entry Identifier (Example) Description
No option H11F1M Standard Through Hole Device S H11F1SM Surface Mount Lead Bend SR2 H11F1SR2M Surface Mount; Tape and Reel V H11F1VM IEC60747−5−5 approval TV H11F1TVM IEC60747−5−5 approval, 0.4” Lead Spacing SV H11F1SVM IEC60747−5−5 approval, Surface Mount SR2V H11F1SR2VM IEC60747−5−5 approval, Surface Mount, Tape and Reel
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Max. Ramp−up Rate = 3°C/s TP Max. Ramp−down Rate = 6°C/s 260 tP 240 TL 220 200 Tsmax tL 180 Preheat Area (_C) 160 Tsmin 140 ts 120 Temperature 100 80 60 40 20 0 120 240 360 Time 25°C to Peak Time (s)
Profile Feature Pb−Free Assembly Profile
Temperature Min. (Tsmin) 150°C Temperature Max. (Tsmax) 200°C Time (t S) from (Tsmin to Tsmax) 60–120 seconds Ramp−up Rate (t L to tP ) 3°C/seconds max. Liquidous Temperature (TL) 217°C Time (t L) Maintained Above (TL) 60–150 seconds Peak Body Package Temperature 260°C +0°C / –5°C Time (t ) within 5 P °C of 260°C 30 seconds Ramp−down Rate (TP to TL) 6°C/seconds max. Time 25°C to Peak Temperature 8 minutes max.
ORDERING INFORMATION Option Order Entry Identifier (Example) Description
No option H11F1M Standard Through Hole Device S H11F1SM Surface Mount Lead Bend SR2 H11F1SR2M Surface Mount; Tape and Reel V H11F1VM IEC60747−5−5 approval TV H11F1TVM IEC60747−5−5 approval, 0.4” Lead Spacing SV H11F1SVM IEC60747−5−5 approval, Surface Mount SR2V H11F1SR2VM IEC60747−5−5 approval, Surface Mount, Tape and Reel
www.onsemi.com 6