Datasheet BYV10-600P (NXP) - 6

NXP Semiconductors BYV10-600P Ultrafast power diode 11. Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead TO-220AC SOD59
E A P A1 q D1 D H Q b1 L 1 2 b c e 0 5 10 mm Dimensions scale Unit A A1 b b1(1) c D D1 E e H L P Q q max 4.7 1.40 0.95 1.7 0.65 15.8 6.8 10.30 16.25 15.0 3.80 2.6 2.9 mm nom 5.08 min 4.3 1.15 0.70 1.3 0.45 15.6 6.4 (REF) 9.65 15.70 12.5 3.65 2.2 2.7 Note 1. Protruded dambar are included in the dimension. sod059_po Outline References European version projection Issue date IEC JEDEC JEITA SOD59 09-08-25 2-lead TO-220AC 12-11-27
Fig. 8. Package outline TO-220AC (SOD59)
BYV10-600P All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved
Product data sheet 30 August 2013 6 / 9
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Package outline 12. Legal information