Datasheet MC74VHC02 (ON Semiconductor) - 5
| Hersteller | ON Semiconductor |
| Beschreibung | Quad 2-Input NOR Gate |
| Seiten / Seite | 6 / 5 — MC74VHC02. PACKAGE DIMENSIONS. SOIC−14. DETAIL A. MILLIMETERS. INCHES. … |
| Dateiformat / Größe | PDF / 146 Kb |
| Dokumentensprache | Englisch |
MC74VHC02. PACKAGE DIMENSIONS. SOIC−14. DETAIL A. MILLIMETERS. INCHES. 13X b. DIM. MIN. MAX. X 45. C SEATING. PLANE. SOLDERING FOOTPRINT*
Modelllinie für dieses Datenblatt
MC74VHC02
Textversion des Dokuments
MC74VHC02 PACKAGE DIMENSIONS SOIC−14
CASE 751A−03 ISSUE K
D A
NOTES: 1. DIMENSIONING AND TOLERANCING PER
B
ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 14 8 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION
A3
SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION.
E
4. DIMENSIONS D AND E DO NOT INCLUDE
H
MOLD PROTRUSIONS. 5. MAXIMUM MOLD PROTRUSION 0.15 PER
L
SIDE. 1 7
DETAIL A MILLIMETERS INCHES
0.25 M B M
13X b DIM MIN MAX MIN MAX A
1.35 1.75 0.054 0.068 0.25 M C A S B S
A1
0.10 0.25 0.004 0.010
A3
0.19 0.25 0.008 0.010
DETAIL A b
0.35 0.49 0.014 0.019
h A D
8.55 8.75 0.337 0.344
X 45 E
3.80 4.00 0.150 0.157
e
1.27 BSC 0.050 BSC
H
5.80 6.20 0.228 0.244
h
0.25 0.50 0.010 0.019
A1 M L
0.40 1.25 0.016 0.049
e M
0 7 0 7
C SEATING PLANE SOLDERING FOOTPRINT*
6.50 14X 1.18 1 1.27 PITCH 14X 0.58 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com 4
CASE 751A−03 ISSUE K
D A
NOTES: 1. DIMENSIONING AND TOLERANCING PER
B
ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 14 8 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION
A3
SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION.
E
4. DIMENSIONS D AND E DO NOT INCLUDE
H
MOLD PROTRUSIONS. 5. MAXIMUM MOLD PROTRUSION 0.15 PER
L
SIDE. 1 7
DETAIL A MILLIMETERS INCHES
0.25 M B M
13X b DIM MIN MAX MIN MAX A
1.35 1.75 0.054 0.068 0.25 M C A S B S
A1
0.10 0.25 0.004 0.010
A3
0.19 0.25 0.008 0.010
DETAIL A b
0.35 0.49 0.014 0.019
h A D
8.55 8.75 0.337 0.344
X 45 E
3.80 4.00 0.150 0.157
e
1.27 BSC 0.050 BSC
H
5.80 6.20 0.228 0.244
h
0.25 0.50 0.010 0.019
A1 M L
0.40 1.25 0.016 0.049
e M
0 7 0 7
C SEATING PLANE SOLDERING FOOTPRINT*
6.50 14X 1.18 1 1.27 PITCH 14X 0.58 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com 4