Outline Dimensions www.vishay.com Vishay Semiconductors TO-220AC 2LDIMENSIONS in millimeters and inches A 0.014 M B A M (6) Thermal pad E A (E) A1 1 2 B Q Ø P (6) A D D H1 (H1) L1 (2) C C D2 (6) (6) D c D1 2 x b 2 x b2 Detail B Detail B A2 L E1 (6) C Base metal (b, b2) Plating A c c1 (4) 2 x e View A - A e1 (4) b1, b3 0.015 M B A M Section C - C and D - D Lead tip Conforms to JEDEC® outline TO-220ACSYMBOLMILLIMETERSINCHESNOTESSYMBOLMILLIMETERSINCHESNOTESMIN.MAX.MIN.MAX.MIN.MAX.MIN.MAX. A 4.25 4.65 0.167 0.183 D2 11.68 13.30 0.460 0.524 6, 7 A1 1.14 1.40 0.045 0.055 E 10.11 10.51 0.398 0.414 3, 6 A2 2.50 2.92 0.098 0.115 E1 6.86 8.89 0.270 0.350 6 b 0.69 1.01 0.027 0.040 e 2.41 2.67 0.095 0.105 b1 0.38 0.97 0.015 0.038 4 e1 4.88 5.28 0.192 0.208 b2 1.20 1.73 0.047 0.068 H1 6.09 6.48 0.240 0.255 6 b3 1.14 1.73 0.045 0.068 4 L 13.52 14.02 0.532 0.552 c 0.36 0.61 0.014 0.024 L1 3.32 3.82 0.131 0.150 2 c1 0.36 0.56 0.014 0.022 4 Ø P 3.54 3.91 0.139 0.154 D 14.85 15.35 0.585 0.604 3 Q 2.60 3.00 0.102 0.118 D1 8.38 9.02 0.330 0.355 Notes (1) Dimensioning and tolerancing as per ASME Y14.5M-1994 (2) Lead dimension and finish uncontrolled in L1 (3) Dimension D, D1, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the outermost extremes of the plastic body (4) Dimension b1, b3, and c1 apply to base metal only (5) Controlling dimensions: inches (6) Thermal pad contour optional within dimensions E, H1, D2, and E1 (7) Outline conforms to JEDEC® TO-220, except D2 Revision: 07-Mar-2022 1 Document Number: 96156 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000