Datasheet BD135, BD136, BD139, BD140 (STMicroelectronics) - 6

Package mechanical data BD135 - BD136 - BD139 - BD140 3 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 6/9 Document Outline Figure 1. Internal schematic diagram Table 1. Device summary 1 Electrical ratings Table 2. Absolute maximum ratings Table 3. Thermal data 2 Electrical characteristics Table 4. On/off states 2.1 Electrical characteristics (curves) Figure 2. Safe operating area Figure 3. Derating 3 Package mechanical data 4 Revision history Table 5. Document revision history