Datasheet TLP5212 (Toshiba) - 4

TLP5212
7. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 ℃)
Characteristics Symbol Note RATING Unit LED Input forward current IF 25 mA LED Input forward current derating (Ta ≥ 90°C) ∆IF/∆Ta -0.65 mA/°C Peak transient input LED forward current IFPT Note 1 1 A LED & LED Reverse input voltage VR 5 V Feedback FAULT feedback IC supply voltage V (control er CC1 −0.5 to 7 V side) FAULT feedback output current I 𝐅𝐅�𝐅𝐅𝐅𝐅 ���� 𝐅𝐅 �� 𝐅𝐅 ��� 8 mA FAULT feedback output voltage V 𝐅𝐅�𝐅𝐅𝐅𝐅 ���� 𝐅𝐅 �� 𝐅𝐅 ��� −0.5 to VCC1 V Input LED power dissipation PD 60 mW Input LED power dissipation derating (Ta ≥ 90°C) ∆ PD /∆Ta −1.9 mW/°C Peak high-level output current IOPH Note 2 -2.5 A Ta = −40 to 110 °C Note 3 Peak low-level output current IOPL +2.5 A Total output side supply voltage (VCC2-VEE) -0.5 to 35 V Negative output side supply voltage (V Output E-VEE) -0.5 to 15 V (gate Positive output side supply voltage (VCC2-VE) -0.5 to 35 − (VE-VEE) V Driver Output voltage V side) OUT VEE to VCC2 V Peak power device gate clamping sinking current IClamp 2.5 A Miller clamping pin voltage VClamp VEE to VCC2 V DESAT pin voltage VDESAT VE to VE + 10 V Output gate drive IC power dissipation PO Note 3 600 mW PO derating (Ta ≥90°C) ∆ PO /∆Ta Note 3 -13.0 mW/°C Common Operating temperature range Topr -40 ~ 110 °C Storage temperature range Tstg -55 ~ 125 °C Lead soldering temperature (10 s) Tsol Note 4 260 °C Isolation voltage (AC, 60 s, R.H. ≤ 60%) BVS Note 5 5000 Vrms Note : Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/”Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc.) Note 1: Pulse width ≤ 1 μs, 300 pps Note 2: Exponential waveform. Pulse width ≤ 0.28 μs, f ≤ 25 kHz, VCC2 = 15 to 30 V Note 3: Mounting on a substrate designated in accordance with JEDEC JESD51-7. Note 4: For the effective lead soldering area. Note 5: This device considered a two-terminal device: All pins on the LED side are shorted together, and al pins on the photodetector side are shorted together. ©2022 4 2022-03-02 Toshiba Electronic Devices & Storage Corporation. Rev.1.0