Datasheet MBRS130LT3G, SBRS8130LT3G, SBRS8130LN (ON Semiconductor) - 5
| Hersteller | ON Semiconductor |
| Beschreibung | Schottky Power Rectifier Surface Mount Power Package |
| Seiten / Seite | 6 / 5 — PACKAGE DIMENSIONS. SMB. SCALE 1:1. Polarity Band. Non−Polarity Band. … |
| Revision | 11 |
| Dateiformat / Größe | PDF / 279 Kb |
| Dokumentensprache | Englisch |
PACKAGE DIMENSIONS. SMB. SCALE 1:1. Polarity Band. Non−Polarity Band. MILLIMETERS. INCHES. DIM. MIN. NOM. MAX. POLARITY INDICATOR
Modelllinie für dieses Datenblatt
Textversion des Dokuments
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS SMB
CASE 403A−03 ISSUE J DATE 19 JUL 2012
SCALE 1:1 SCALE 1:1 Polarity Band Non−Polarity Band HE
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
E
2. CONTROLLING DIMENSION: INCH. 3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A
1.95 2.30 2.47 0.077 0.091 0.097
b D A1
0.05 0.10 0.20 0.002 0.004 0.008
b
1.96 2.03 2.20 0.077 0.080 0.087
c
0.15 0.23 0.31 0.006 0.009 0.012
D
3.30 3.56 3.95 0.130 0.140 0.156
E
4.06 4.32 4.60 0.160 0.170 0.181
POLARITY INDICATOR HE
5.21 5.44 5.60 0.205 0.214 0.220
OPTIONAL AS NEEDED L
0.76 1.02 1.60 0.030 0.040 0.063
L1
0.51 REF 0.020 REF
A GENERIC MARKING DIAGRAM* c A1 L L1
AYWW AYWW XXXXXG XXXXXG G G
SOLDERING FOOTPRINT* Polarity Band Non−Polarity Band
2.261 0.089 XXXXX = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package 2.743 (Note: Microdot may be in either location) 0.108 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 2.159 0.085 SCALE 8:1 ǒ mm Ǔ inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98ASB42669B
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: SMB PAGE 1 OF 1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com
PACKAGE DIMENSIONS SMB
CASE 403A−03 ISSUE J DATE 19 JUL 2012
SCALE 1:1 SCALE 1:1 Polarity Band Non−Polarity Band HE
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
E
2. CONTROLLING DIMENSION: INCH. 3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX A
1.95 2.30 2.47 0.077 0.091 0.097
b D A1
0.05 0.10 0.20 0.002 0.004 0.008
b
1.96 2.03 2.20 0.077 0.080 0.087
c
0.15 0.23 0.31 0.006 0.009 0.012
D
3.30 3.56 3.95 0.130 0.140 0.156
E
4.06 4.32 4.60 0.160 0.170 0.181
POLARITY INDICATOR HE
5.21 5.44 5.60 0.205 0.214 0.220
OPTIONAL AS NEEDED L
0.76 1.02 1.60 0.030 0.040 0.063
L1
0.51 REF 0.020 REF
A GENERIC MARKING DIAGRAM* c A1 L L1
AYWW AYWW XXXXXG XXXXXG G G
SOLDERING FOOTPRINT* Polarity Band Non−Polarity Band
2.261 0.089 XXXXX = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package 2.743 (Note: Microdot may be in either location) 0.108 *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ G”, may or may not be present. 2.159 0.085 SCALE 8:1 ǒ mm Ǔ inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98ASB42669B
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DESCRIPTION: SMB PAGE 1 OF 1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2019 www.onsemi.com