Datasheet STTH1L06 (STMicroelectronics) - 6
| Hersteller | STMicroelectronics |
| Beschreibung | Turbo 2 ultrafast high voltage rectifier |
| Seiten / Seite | 9 / 6 — Package information. STTH1L06. 2 Package. information. Table 6. SMA … |
| Dateiformat / Größe | PDF / 112 Kb |
| Dokumentensprache | Englisch |
Package information. STTH1L06. 2 Package. information. Table 6. SMA dimensions. Dimensions. Ref. Millimeters. Inches. Min. Max. Figure 16
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Package information STTH1L06 2 Package information
● Epoxy meets UL 94, V0 ● Band indicates cathode ● Bending method (DO-41): see Application note AN1471 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.
Table 6. SMA dimensions Dimensions Ref. Millimeters Inches E1 Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.094
D
A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065
E
c 0.15 0.40 0.006 0.016
A1
D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211
C A2 L b
E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059
Figure 16. Footprint (dimensions in mm) 1.4 2.63 1.4 1.64 5.43
6/9 Doc ID 8321 Rev 4 Document Outline Table 1. Device summary 1 Characteristics Table 2. Absolute ratings (limiting values) Table 3. Thermal parameters Table 4. Static electrical characteristics Table 5. Dynamic characteristics Figure 1. Conduction losses versus average current Figure 2. Forward voltage drop versus forward current Figure 3. Relative variation of thermal impedance junction ambient versus pulse duration Figure 4. Relative variation of thermal impedance junction ambient versus pulse duration Figure 5. Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4) Figure 6. Peak reverse recovery current versus dIF/dt (90% confidence) Figure 7. Reverse recovery time versus dIF/dt (90% confidence) Figure 8. Reverse recovery charges versus dIF/dt (90% confidence) Figure 9. Softness factor versus dIF/dt (typical values) Figure 10. Relative variations of dynamic parameters versus junction temperature Figure 11. Transient peak forward voltage versus dIF/dt (90% confidence) Figure 12. Forward recovery time versus dIF/dt (90% confidence) Figure 13. Junction capacitance versus reverse voltage applied (typical values) Figure 14. Thermal resistance junction to ambient versus copper surface under each lead Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35 µm) 2 Package information Table 6. SMA dimensions Figure 16. Footprint (dimensions in mm) Table 7. SMB dimensions Figure 17. Footprint (dimensions in mm) Table 8. DO-41 (plastic) dimensions 3 Ordering information Table 9. Ordering information 4 Revision history Table 10. Document revision history
● Epoxy meets UL 94, V0 ● Band indicates cathode ● Bending method (DO-41): see Application note AN1471 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.
Table 6. SMA dimensions Dimensions Ref. Millimeters Inches E1 Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.094
D
A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065
E
c 0.15 0.40 0.006 0.016
A1
D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211
C A2 L b
E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059
Figure 16. Footprint (dimensions in mm) 1.4 2.63 1.4 1.64 5.43
6/9 Doc ID 8321 Rev 4 Document Outline Table 1. Device summary 1 Characteristics Table 2. Absolute ratings (limiting values) Table 3. Thermal parameters Table 4. Static electrical characteristics Table 5. Dynamic characteristics Figure 1. Conduction losses versus average current Figure 2. Forward voltage drop versus forward current Figure 3. Relative variation of thermal impedance junction ambient versus pulse duration Figure 4. Relative variation of thermal impedance junction ambient versus pulse duration Figure 5. Relative variation of thermal impedance junction ambient versus pulse duration (epoxy FR4) Figure 6. Peak reverse recovery current versus dIF/dt (90% confidence) Figure 7. Reverse recovery time versus dIF/dt (90% confidence) Figure 8. Reverse recovery charges versus dIF/dt (90% confidence) Figure 9. Softness factor versus dIF/dt (typical values) Figure 10. Relative variations of dynamic parameters versus junction temperature Figure 11. Transient peak forward voltage versus dIF/dt (90% confidence) Figure 12. Forward recovery time versus dIF/dt (90% confidence) Figure 13. Junction capacitance versus reverse voltage applied (typical values) Figure 14. Thermal resistance junction to ambient versus copper surface under each lead Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35 µm) 2 Package information Table 6. SMA dimensions Figure 16. Footprint (dimensions in mm) Table 7. SMB dimensions Figure 17. Footprint (dimensions in mm) Table 8. DO-41 (plastic) dimensions 3 Ordering information Table 9. Ordering information 4 Revision history Table 10. Document revision history