Datasheet AD9696, AD9698 (Analog Devices) - 3

AD9696/AD9698 0
8
C to +70
8
C –55
8
C to +125
8
C AD9696/AD9698 AD9696/AD9698 Test KN/KQ/KR TQ Parameter Temp Level Min Typ Max Min Typ Max Units
POWER SUPPLY6 Positive Supply Current7 (+5.0 V) AD9696 Full VI 26 32 26 32 mA AD9698 Full VI 52 64 52 64 mA Negative Supply Current8 (–5.2 V) AD9696 Full VI 2.5 4.0 2.5 4.0 mA AD9698 Full VI 5.0 8.0 5.0 8.0 mA Power Dissipation AD9696 +5.0 V Full V 130 130 mW AD9696 ± 5.0 V Full V 146 146 mW AD9698 +5.0 V Full V 260 260 mW AD9698 ± 5.0 V Full V 292 292 mW Power Supply Rejection Ratio9 +25°C VI 70 70 dB Full VI 65 65 dB NOTES 3Load circuit has 420 Ω from +VS to output; 460 Ω from output to ground. 1Absolute maximum ratings are limiting values, to be applied individually, 4R ≤ S 100 Ω. and beyond which the serviceability of the circuit may be impaired. Functional 5Propagation delays measured with 100 mV pulse; 10 mV overdrive. operability is not necessarily implied. Exposure to absolute maximum rating 6Supply voltages should remain stable within ±5% for normal operation. conditions for an extended period of time may affect device reliability. 7Specification applies to both +5 V and ±5 V supply operation. 2Typical thermal impedances: 8Specification applies to only ±5 V supply operation. AD9696 Metal Can θ 9 JA = 170°C/W θJC = 50°C/W Measured with nominal values ± 5% of +VS and –VS. AD9696 Ceramic DIP θ 10 JA = 110°C/W θJC = 20°C/W Although fall time is faster than rise time, the complementary outputs cross at AD9696 Plastic DIP θJA = 160°C/W θJC = 30°C/W midpoint of logic swing because of delay on start of falling edge. AD9696 Plastic SOIC θJA = 180°C/W θJC = 30°C/W Specifications subject to change without notice. AD9698 Ceramic DIP θJA = 90°C/W θJC = 25°C/W AD9698 Plastic DIP θJA = 100°C/W θJC = 20°C/W AD9698 Plastic SOIC θJA = 120°C/W θJC = 20°C/W
ORDERING GUIDE EXPLANATION OF TEST LEVELS Package Test Level Model Package Temperature Option1
I – 100% production tested. II – 100% production tested at +25°C, and sample tested at AD9696KN Plastic DIP 0°C to +70°C N-8 specified temperatures. AD9696KR SOIC 0°C to +70°C R-8 III – Sample tested only. AD9696KQ Cerdip 0°C to +70°C Q-8 IV – Parameter is guaranteed by design and characterization AD9696TQ Cerdip –55°C to +125°C Q-8 testing. AD9696TZ/883B2 Gullwing –55°C to +125°C Z-8A V – Parameter is a typical value only. AD9698KN Plastic DIP 0°C to +70°C N-16 VI – All devices are 100% production tested at +25°C. AD9698KR SOIC 0°C to +70°C R-16A 100% production tested at temperature extremes for AD9698KQ Cerdip 0°C to +70°C Q-16 extended temperature devices; sample tested at temp- AD9698TQ Cerdip –55°C to +125°C Q-16 erature extremes for commercial/industrial devices. AD9698TZ/883B3 Gullwing –55°C to +125°C Z-16 NOTES 1N = Plastic DIP, Q = Cerdip, R = Small Outline (SOIC), Z = Ceramic Leaded Chip Carrier. 2Refer to AD9696TZ/883B military data sheet. 3Refer to AD9698TZ/883B military data sheet. REV. B –3–