Datasheet A1321, A1322, A1323 (Allegro) - 10

A1321, A1322, Ratiometric Linear Hall Effect Sensor ICs and A1323 for High-Temperature Operation THERMAL CHARACTERISTICS may require derating at maximum conditions, see application information Characteristic Symbol Test Conditions* Value Units
Package LH, 1-layer PCB with copper limited to solder pads 228 ºC/W Package LH, 2-layer PCB with 0.463 in.2 of copper area each side Package Thermal Resistance RθJA 110 ºC/W connected by thermal vias Package UA, 1-layer PCB with copper limited to solder pads 165 ºC/W *Additional thermal information available on Allegro website. Power Derating Curve 6 VCC(max) 5 1-layer PCB, Package LH (V) (RQJA = 228 ºC/W) CC V V CC(min) 1-layer PCB, Package UA 4 (RQJA = 165 ºC/W) 2-layer PCB, Package LH (R 3 QJA = 110 ºC/W) 2 Maximum Allowable 1 0 20 40 60 80 100 120 140 160 180 Temperature (ºC)
Power Dissipation versus Ambient Temperature
1900 1800 1700 1600 1500 1400 1300 1200 2-layer PCB, Package LH (mW) (R D 1100 QJA 1000 = 110 ºC/W) 900 1-layer PCB, Package UA (R 800 QJA = 165 ºC/W) 700 600 500 1-layer PCB, Package LH 400 (R Power Dissipation, P 300 QJA = 228 ºC/W) 200 100 0 20 40 60 80 100 120 140 160 180 Temperature (°C) Allegro MicroSystems, Inc. 9 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com