Datasheet ADG428, ADG429 (Analog Devices) - 4

ADG428/ADG429 ABSOLUTE MAXIMUM RATINGS1 ADG428 PIN CONFIGURATIONS
(TA = +25°C unless otherwise noted.)
DIP/SOIC PLCC
VDD to VSS . .+44 V VDD to GND . –0.3 V to +25 V V
WR 1 18 RS A0 WR NC RS A1
SS to GND . +0.3 V to –25 V
3 2 1 20 19
Analog, Digital Inputs2 . V
A0 2 17 A1
SS – 2 V to VDD + 2 V or 30 mA, Whichever Occurs First
EN 4 PIN 1 18 A2 EN 3 16 A2 IDENTIFIER
Continuous Current, S or D . 30 mA
V 5 17 GND V SS 4 15 SS GND ADG428 ADG428
Peak Current, S or D . 100 mA
S1 6 16 VDD S1 5 TOP VIEW 14 V TOP VIEW DD
(Pulsed at 1 ms, 10% Duty Cycle Max)
(Not to Scale) S2 7 (Not to Scale) 15 S5 S2 6 13 S5
Operating Temperature Range
S3 8 14 S6 S3 7 12 S6
Industrial (B Version) . –40°C to +85°C
S4 8 11 S7 9 10 11 12 13
Extended (T Version) . –55°C to +125°C
D D 9 10 S8 S4 NC S8 S7
Storage Temperature Range . –65°C to +150°C
NC = NO CONNECT
Junction Temperature . +150°C Cerdip Package, Power Dissipation . 900 mW θJA, Thermal Impedance . 73°C/W Lead Temperature, Soldering (10 sec) . +300°C Plastic Package, Power Dissipation . 470 mW
ADG429 PIN CONFIGURATIONS
θJA, Thermal Impedance . 115°C/W Lead Temperature, Soldering (10 sec) . +260°C
DIP PLCC
SOIC Package, Power Dissipation . 600 mW θJA, Thermal Impedance . 77°C/W
WR 1 18 RS A0 WR NC RS A1
Lead Temperature, Soldering
3 2 1 20 19 A0 2 17 A1
Vapor Phase (60 sec) . +215°C
EN 4 PIN 1 18 GND
PLCC Package, Power Dissipation . 800 mW
EN 3 16 GND IDENTIFIER
θ
V 5 17 V V SS DD 4 15 SS V ADG429
JA, Thermal Impedance . 90°C/W
ADG429 DD S1A 6 16 S1B
Lead Temperature, Soldering
S1A 5 TOP VIEW 14 S1B TOP VIEW (Not to Scale) S2A 7 (Not to Scale) 15 S2B
Vapor Phase (60 sec) . +215°C
S2A 6 13 S2B S3A 8 14 S3B
Infrared (15 sec) . +220°C
S3A 7 12 S3B
NOTES
S4A 8 11 S4B 9 10 11 12 13
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
DA 9 10 DB DA NC DB S4A S4B
nent damage to the device. This is a stress rating only; functional operation of the
NC = NO CONNECT
device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2Overvoltages at A, EN, WR, RS, S or D will be clamped by internal diodes. Current should be limited to the maximum ratings given.
ORDERING GUIDE Model1 Temperature Range Package Options2
ADG428BN –40°C to +85°C N-18 ADG428BP –40°C to +85°C P-20A ADG428BR –40°C to +85°C R-18 ADG428TQ –55°C to +125°C Q-18 ADG429BN –40°C to +85°C N-18 ADG429BP –40°C to +85°C P-20A ADG429TQ –55°C to +125°C Q-18 NOTES 1For availability of MIL-STD-883, Class B processed parts, contact factory. 2N = Plastic DIP; P = Plastic Leaded Chip Carrier (PLCC); Q = Cerdip; R = Small Outline IC (SOIC).
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
WARNING!
accumulate on the human body and test equipment and can discharge without detection. Although the ADG428/ADG429 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD SENSITIVE DEVICE
ESD precautions are recommended to avoid performance degradation or loss of functionality. –4– REV. C