link to page 6 Data SheetADG1419ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a Table 5. stress rating only; functional operation of the product at these Parameter Rating or any other conditions above those indicated in the operational VDD to VSS 35 V section of this specification is not implied. Operation beyond VDD to GND −0.3 V to +25 V the maximum operating conditions for extended periods may VSS to GND +0.3 V to −25 V affect product reliability. Analog Inputs1 VSS − 0.3 V to VDD + 0.3 V or 30 mA, whichever occurs first THERMAL RESISTANCE Digital Inputs1 GND − 0.3 V to VDD + 0.3 V or Table 6. Thermal Resistance 30 mA, whichever occurs first Package Typeθ Peak Current, S or D JAθJC Unit (Pulsed at 1 ms, 10% 8-Lead MSOP (4-Layer Board) 206 44 °C/W Duty-Cycle Maximum) 8-Lead LFCSP 50.8 °C/W 8-Lead MSOP (4-Layer Board) 400 mA 8-Lead LFCSP 600 mA Continuous Current per Data in Table 4 + 15% mA ESD CAUTION Channel, S or D Operating Temperature Range Industrial −40°C to +125°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C Reflow Soldering Peak 260°C Temperature, Pb Free 1 Over voltages at IN, S, or D are clamped by internal diodes. Current should be limited to the maximum ratings given. Rev. A | Page 7 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ±15 V DUAL SUPPLY +12 V SINGLE SUPPLY ±5 V DUAL SUPPLY CONTINUOUS CURRENT PER CHANNEL, S OR D ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY OUTLINE DIMENSIONS ORDERING GUIDE