Datasheet ADG5436 (Analog Devices) - 9

HerstellerAnalog Devices
BeschreibungHigh Voltage Latch-Up Proof, Dual SPDT Switches
Seiten / Seite19 / 9 — Data Sheet. ADG5436. PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS. IN1 1. …
RevisionC
Dateiformat / GrößePDF / 498 Kb
DokumentenspracheEnglisch

Data Sheet. ADG5436. PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS. IN1 1. 16 NC. S1A 2. 15 NC. D1 3. 14 NC. S1B. D1 1. 12 EN. 13 VDD. TOP VIEW

Data Sheet ADG5436 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS IN1 1 16 NC S1A 2 15 NC D1 3 14 NC S1B D1 1 12 EN 13 VDD TOP VIEW

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Data Sheet ADG5436 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS A 1 IN1 1 16 NC 1 N C C S I N N 6 5 4 3 S1A 2 15 NC 1 1 1 1 D1 3 14 NC S1B ADG5436 D1 1 12 EN 4 13 VDD TOP VIEW S1B 2 ADG5436 11 V V DD SS 5 12 S2B (Not to Scale) V TOP VIEW SS 3 10 S2B GND 6 11 D2 (Not to Scale) GND 4 9 D2 NC 7 10 S2A NC 8 9 IN2 5 6 7 8
03 -0
C 2 C A
04
NC = NO CONNECT N NI N 2
92 0
S NOTES
4 0 0
1. EXPOSED PAD TIED TO SUBSTRATE, V
4-
SS. 2. NC = NO CONNECT.
920 0 Figure 3. TSSOP Pin Configuration Figure 4. LFCSP Pin Configuration
Table 7. Pin Function Descriptions Pin No. TSSOP LFCSP Mnemonic Function
1 15 IN1 Logic Control Input 1. 2 16 S1A Source Terminal 1A. This pin can be an input or output. 3 1 D1 Drain Terminal 1. This pin can be an input or output. 4 2 S1B Source Terminal 1B. This pin can be an input or output. 5 3 VSS Most Negative Power Supply Potential. 6 4 GND Ground (0 V) Reference. 7, 8, 14 to 16 5, 7, 13, 14 NC No Connect. 9 6 IN2 Logic Control Input 2. 10 8 S2A Source Terminal 2A. This pin can be an input or output. 11 9 D2 Drain Terminal 2. This pin can be an input or output. 12 10 S2B Source Terminal 2B. This pin can be an input or output. 13 11 VDD Most Positive Power Supply Potential. Not applicable 12 EN Active High Digital Input. When this pin is low, the device is disabled and all switches are off. When this pin is high, INx logic inputs determine the on switches. Not applicable EPAD The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
TRUTH TABLE FOR SWITCHES Table 8. ADG5436 TSS OP Truth Table INx SxA SxB
0 Off On 1 On Off
Table 9. ADG5436 LFCSP Tru th Table EN INx SxA SxB
0 X1 Off Off 1 0 Off On 1 1 On Off 1 X is don’t care. Rev. C | Page 9 of 19 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS REVISION HISTORY SPECIFICATIONS ±15 V DUAL SUPPLY ±20 V DUAL SUPPLY 12 V SINGLE SUPPLY 36 V SINGLE SUPPLY CONTINUOUS CURRENT PER CHANNEL, Sx OR Dx ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TRUTH TABLE FOR SWITCHES TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY TRENCH ISOLATION APPLICATIONS INFORMATION OUTLINE DIMENSIONS ORDERING GUIDE