Datasheet CMPZ5235B - CMPZ5261B (Central Semiconductor) - 3

BARE DIE PACKING OPTIONS BARE DIE IN TRAY (WAFFLE) PACK CT
: Singulated die in tray (waffle) pack.
(example: CP211-PART NUMBER-CT) CM
: Singulated die in tray (waffle) pack 100% visually inspected as per MIL-STD-750, (method 2072 transistors, method 2073 diodes).
(example: CP211-PART NUMBER-CM) UNSAWN WAFER WN
: Full wafer, unsawn, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WN) SAWN WAFER ON PLASTIC RING WR
: Full wafer, sawn and mounted on plastic ring, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WR)
Please note: Sawn Wafer on Metal Frame (WS) is possible as a special order. Please contact your Central Sales Representative at 631-435-1110. Visit the Central website for a complete listing of specifications:
www.centralsemi.com/bdspecs
R2 (3-April 2017)
www.centra lsemi.com