Datasheet MAX1595 (Maxim) - 2
| Hersteller | Maxim |
| Beschreibung | Regulated 3.3V/5.0V Step-Up/Step-Down Charge Pump |
| Seiten / Seite | 7 / 2 — Regulated 3.3V/5.0V Step-Up/ Step-Down Charge Pump. ABSOLUTE MAXIMUM … |
| Dateiformat / Größe | PDF / 178 Kb |
| Dokumentensprache | Englisch |
Regulated 3.3V/5.0V Step-Up/ Step-Down Charge Pump. ABSOLUTE MAXIMUM RATINGS. MAX1595
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Regulated 3.3V/5.0V Step-Up/ Step-Down Charge Pump ABSOLUTE MAXIMUM RATINGS
IN, OUT, AOUT to GND..-0.3V to +6V Continuous Power Dissipation (TA = +70°C) SHDN to PGND ..-0.3V to +6V µMAX (derate 4.8mW/°C above +70°C) ..387.8mW PGND to GND ...-0.3V to +0.3V TQFN-EP (derate 24.4mW/°C above +70°C) ...1951.2mW CXN to PGND...-0.3V to (Lower of IN + 0.8V or 6.3V) Operating Temperature Range ...-40°C to +85°C CXP to GND ..-0.8V to (Higher of OUT + 0.8V Junction Temperature ..+150°C or IN + 0.8V but not greater than 6V) Storage Temperature Range ...-65°C to +150°C Continuous Output Current ...150mA Lead Temperature (soldering, 10s) ...+300°C
MAX1595
Soldering Temperature (reflow) ...+260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN µMAX Junction-to-Ambient Thermal Resistance (θJA)..41°C/W Junction-to-Ambient Thermal Resistance (θJA)...206.3°C/W Junction-to-Case Thermal Resistance (θJC)...6°C/W Junction-to-Case Thermal Resistance (θJC)...42°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial
.
ELECTRICAL CHARACTERISTICS
(VIN = 2V for MAX1595_ _ _33, VIN = 3V for MAX1595_ _ _50, CIN = 1µF, CX = 0.22µF, COUT = 1µF, TA = -40° to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Input Voltage Range VIN 1.8 5.5 V Input Undervoltage Lockout 1.40 1.60 1.72 V Threshold Input Undervoltage Lockout 40 mV Hysteresis 0 < I T L OA D < 125m A, A = 0°C to +85°C 4.85 5.05 5.15 V I N = + 3.0V TA = -40°C to +85°C 4.80 5.20 0 < I T LOAD < 75mA, VIN A = 0°C to +85°C 3.20 3.33 3.40 Output Voltage VOUT V = +2.0V TA = -40°C to +85°C 3.16 3.44 0 < I T LOAD < 30mA, VIN A = 0°C to +85°C 3.20 3.33 3.40 = +1.8V TA = -40°C to +85°C 3.16 3.44 VIN = +2.0V, MAX1595_ _ _33 220 320 No-Load Input Current IQ µA VIN = +3.0V, MAX1595_ _ _50 240 350 Switching Frequency fOSC IL OA D > 20m A, V OU T > VIN 0.85 1.0 1.15 MHz Shutdown Supply Current ISHDN VSHDN = 0V, VIN = +5.5V, VOUT = 0V 5 µA SHDN Input Voltage Low V IN L VIN = 2.0V to 5.5V 0.6 V SHDN Input Voltage High V IN H VIN = 2.0V to 5.5V 1.6 V SHDN Input Leakage Current 0.1 µA
Note 2:
Specifications to -40°C are guaranteed by design, not production tested.
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IN, OUT, AOUT to GND..-0.3V to +6V Continuous Power Dissipation (TA = +70°C) SHDN to PGND ..-0.3V to +6V µMAX (derate 4.8mW/°C above +70°C) ..387.8mW PGND to GND ...-0.3V to +0.3V TQFN-EP (derate 24.4mW/°C above +70°C) ...1951.2mW CXN to PGND...-0.3V to (Lower of IN + 0.8V or 6.3V) Operating Temperature Range ...-40°C to +85°C CXP to GND ..-0.8V to (Higher of OUT + 0.8V Junction Temperature ..+150°C or IN + 0.8V but not greater than 6V) Storage Temperature Range ...-65°C to +150°C Continuous Output Current ...150mA Lead Temperature (soldering, 10s) ...+300°C
MAX1595
Soldering Temperature (reflow) ...+260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN µMAX Junction-to-Ambient Thermal Resistance (θJA)..41°C/W Junction-to-Ambient Thermal Resistance (θJA)...206.3°C/W Junction-to-Case Thermal Resistance (θJC)...6°C/W Junction-to-Case Thermal Resistance (θJC)...42°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial
.
ELECTRICAL CHARACTERISTICS
(VIN = 2V for MAX1595_ _ _33, VIN = 3V for MAX1595_ _ _50, CIN = 1µF, CX = 0.22µF, COUT = 1µF, TA = -40° to +85°C, unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Input Voltage Range VIN 1.8 5.5 V Input Undervoltage Lockout 1.40 1.60 1.72 V Threshold Input Undervoltage Lockout 40 mV Hysteresis 0 < I T L OA D < 125m A, A = 0°C to +85°C 4.85 5.05 5.15 V I N = + 3.0V TA = -40°C to +85°C 4.80 5.20 0 < I T LOAD < 75mA, VIN A = 0°C to +85°C 3.20 3.33 3.40 Output Voltage VOUT V = +2.0V TA = -40°C to +85°C 3.16 3.44 0 < I T LOAD < 30mA, VIN A = 0°C to +85°C 3.20 3.33 3.40 = +1.8V TA = -40°C to +85°C 3.16 3.44 VIN = +2.0V, MAX1595_ _ _33 220 320 No-Load Input Current IQ µA VIN = +3.0V, MAX1595_ _ _50 240 350 Switching Frequency fOSC IL OA D > 20m A, V OU T > VIN 0.85 1.0 1.15 MHz Shutdown Supply Current ISHDN VSHDN = 0V, VIN = +5.5V, VOUT = 0V 5 µA SHDN Input Voltage Low V IN L VIN = 2.0V to 5.5V 0.6 V SHDN Input Voltage High V IN H VIN = 2.0V to 5.5V 1.6 V SHDN Input Leakage Current 0.1 µA
Note 2:
Specifications to -40°C are guaranteed by design, not production tested.
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