Datasheet BAT46 (STMicroelectronics) - 2

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Characteristics BAT46 Series 1 Characteristics Table 1. Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified) Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 100 V IF Continuous forward current 150 mA IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 1 A Tstg Storage temperature range -65 to +150 ° C Tj Maximum operating junction temperature (1) 150 ° C TL Maximum soldering temperature(1) 260 ° C 1. Pulse test: tp = 380 µs, δ < 2 %
Table 2. Thermal parameters Symbol Parameter Value Unit
SOD-123, SOT-23 500 Rth(j-a) Junction to ambient(1) °C/W SOT-323, SOD-323, 550 1. On epoxy printed circuit board with recommended pad layout
Table 3. Static electrical characteristics Symbol Parameter Test conditions Min. Typ Max. Unit
VR = 1.5 V 0.5 VR = 10 V 0.8 Tj = 25° C VR = 50 V 2 VR = 75 V 5 I (1) R Reverse leakage current µA VR = 1.5 V 5 VR = 10 V 7.5 Tj = 60° C VR = 50 V 15 VR = 75 V 20 IF = 0.1 mA 0.25 V (2) F Forward voltage drop Tj = 25° C I V F =10 mA 0.45 IF =250 mA 1 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 %
Table 4. Dynamic characteristics Symbol Parameter Test conditions Min. Typ Max. Unit
VR = 0 V, F = 1 MHz 10 C Diode capacitance pF VR = 1 V, F = 1 MHz 6 2/11 Document Outline BAT46 Series Small signal Schottky diodes 1 Characteristics Table 1. Absolute ratings (limiting values at Tj = 25˚ C, unless otherwise specified) Table 2. Thermal parameters Table 3. Static electrical characteristics Table 4. Dynamic characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (d = 1) Figure 3. Reverse leakage current versus reverse applied voltage (typical values) Figure 4. Reverse leakage current versus junction temperature Figure 5. Junction capacitance versus reverse applied voltage (typical values) Figure 6. Forward voltage drop versus forward current (typical values, low-level) Figure 7. Forward voltage drop versus forward current (typical values, high-level) Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration - printed circuit board, epoxy FR4 eCU = 35 µm (SOD-323) Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration - aluminium oxide substrate 10 mm x 8 mm x 0.5 mm (SOT-23) Figure 10. Variation of thermal impedance junction to ambient versus pulse duration - printed circuit board, epoxy FR4, eCU = 35 µm (SOT-323) Figure 11. Thermal resistance junction to ambient versus copper surface under each lead, epoxy FR4, eCU = 35 µm (SOD-323) 2 Ordering information scheme 3 Package information Table 5. SOD-123 dimensions Figure 12. SOD-123 footprint (dimensions in mm) Table 6. SOD-323 dimensions Figure 13. SOD-323 footprint (dimensions in mm) Table 7. SOT-23 dimensions Figure 14. SOT-23 footprint (dimensions in mm) Table 8. SOT-323 dimensions Figure 15. SOT-323 footprint (dimensions in mm) 4 Ordering information 5 Revision history