Datasheet RB520S30 (Nexperia) - 3

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Nexperia RB520S30 200 mA low VF MEGA Schottky barrier rectifier 8. Limiting values Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VR reverse voltage Tj = 25 °C - 30 V IF(AV) average forward current δ = 0.5; f = 20 kHz; square wave; Tamb ≤ [1] - 200 mA 105 °C δ = 0.5; f = 20 kHz; square wave; Tsp ≤ - 200 mA 135 °C IFSM non-repetitive peak tp = 8.3 ms; half sine wave; Tj(init) = 25 °C - 1 A forward current Ptot total power dissipation Tamb ≤ 25 °C [2] - 275 mW [1] - 420 mW [3] - 500 mW Tj junction temperature - 150 °C Tamb ambient temperature -55 150 °C Tstg storage temperature -65 150 °C [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on a ceramic PCB, Al2O3, standard footprint.
9. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from in free air [1] [2] - - 455 K/W junction to ambient [1] [3] - - 300 K/W [1] [4] - - 250 K/W Rth(j-sp) thermal resistance from [1] [5] - - 90 K/W junction to solder point [1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [4] Device mounted on a ceramic PCB, Al2O3, standard footprint. [5] Soldering point of cathode tab. RB520S30 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2021. Al rights reserved
Product data sheet 7 April 2021 3 / 12
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Characteristics 11. Test information 12. Package outline 13. Soldering 14. Revision history 15. Legal information Contents