Preliminary Datasheet EPC2302 (Efficient Power Conversion) - 8
| Hersteller | Efficient Power Conversion |
| Beschreibung | Enhancement Mode Power Transistor 100 V, 1.8 mΩ max |
| Seiten / Seite | 8 / 8 — eGaN® FET DATASHEET. RECOMMENDED. LAND PATTERN. DIM. Nominal. STENCIL … |
| Dateiformat / Größe | PDF / 1.1 Mb |
| Dokumentensprache | Englisch |
eGaN® FET DATASHEET. RECOMMENDED. LAND PATTERN. DIM. Nominal. STENCIL DRAWING
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eGaN® FET DATASHEET
EPC2302
RECOMMENDED
c1 c2
LAND PATTERN
Land pattern is solder mask defined. f g (units in mm) It is recommended to have on-Cu trace PCB vias. d1
DIM Nominal A
5.4 d2 h
B
3.4
c1
2.1
c2
0.875 e A
d1
0.47
d2
0.37
e
0.85
f
0.29
g
0.2 R50
h
0.06 g d2 B
RECOMMENDED
g1 g2
STENCIL DRAWING
c1 c2 Recommended stencil should be 4 mil (100 um) thick, must be (units in mm) laser cut, openings per drawing. d1 d3 Intended for use with SAC305 Type 3 solder, reference 88.5% metals content.
DIM Nominal
d2
A
5.22
B
3.32
c1
2
c2
0.875 e A
d1
0.65
d2
0.28
d3
0.6
d4
0.61 g3
e
0.85 R50
g1
0.13
g2
0.11 d4
g3
0.2 g1 B Efficient Power Conversion Corporation (EPC) reserves the right to make changes without further notice to any prod- ucts herein to improve reliability, function or design. EPC does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the Information subject to change without notice. rights of others. eGaN® is a registered trademark of Efficient Power Conversion Corporation. EPC Patent Listing: epc-co.com/epc/AboutEPC/Patents.aspx Revision 1, December, 2021 EPC – POWER CONVERSION TECHNOLOGY LEADER | EPC-CO.COM | ©2021 | | 8
EPC2302
RECOMMENDED
c1 c2
LAND PATTERN
Land pattern is solder mask defined. f g (units in mm) It is recommended to have on-Cu trace PCB vias. d1
DIM Nominal A
5.4 d2 h
B
3.4
c1
2.1
c2
0.875 e A
d1
0.47
d2
0.37
e
0.85
f
0.29
g
0.2 R50
h
0.06 g d2 B
RECOMMENDED
g1 g2
STENCIL DRAWING
c1 c2 Recommended stencil should be 4 mil (100 um) thick, must be (units in mm) laser cut, openings per drawing. d1 d3 Intended for use with SAC305 Type 3 solder, reference 88.5% metals content.
DIM Nominal
d2
A
5.22
B
3.32
c1
2
c2
0.875 e A
d1
0.65
d2
0.28
d3
0.6
d4
0.61 g3
e
0.85 R50
g1
0.13
g2
0.11 d4
g3
0.2 g1 B Efficient Power Conversion Corporation (EPC) reserves the right to make changes without further notice to any prod- ucts herein to improve reliability, function or design. EPC does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the Information subject to change without notice. rights of others. eGaN® is a registered trademark of Efficient Power Conversion Corporation. EPC Patent Listing: epc-co.com/epc/AboutEPC/Patents.aspx Revision 1, December, 2021 EPC – POWER CONVERSION TECHNOLOGY LEADER | EPC-CO.COM | ©2021 | | 8