Datasheet T1610, T1635, T1650, BTA16, BTB16 (STMicroelectronics) - 6
| Hersteller | STMicroelectronics |
| Beschreibung | Snubberless, logic level and standard 16 A Triacs |
| Seiten / Seite | 18 / 6 — T1610, T1635, T1650, BTA16, BTB16. Characteristics (curves) |
| Dateiformat / Größe | PDF / 232 Kb |
| Dokumentensprache | Englisch |
T1610, T1635, T1650, BTA16, BTB16. Characteristics (curves)
Modelllinie für dieses Datenblatt
- BTA16-600B BTA16-600BRG BTA16-600BWRG BTA16-600CRG BTA16-600CWRG BTA16-600SWRG BTA16-800BRG BTA16-800BWRG BTA16-800CWRG BTA16-800SWRG
Textversion des Dokuments
T1610, T1635, T1650, BTA16, BTB16 Characteristics (curves) Figure 12. D²PAK thermal resistance junction to ambient versus copper surface under tab
Rth(j-a) (°C/W) 80 D²PAK 70 Epoxy printed board FR4, copper thickness = 35 µm 60 50 40 30 20 10 SCu(cm²) 0 0 5 10 15 20 25 30 35 40
DS2114
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Rev 11 page 6/18
Document Outline 1 Characteristics 1.1 Characteristics (curves) 2 Package information 2.1 TO-220AB Insulated and non Insulated package information 2.1.1 TO-220AB Insulated and non Insulated package information 2.2 D²PAK package information 2.2.1 D²PAK package information 3 Ordering information 3.1 Product selector 3.2 Ordering information Revision history
Rth(j-a) (°C/W) 80 D²PAK 70 Epoxy printed board FR4, copper thickness = 35 µm 60 50 40 30 20 10 SCu(cm²) 0 0 5 10 15 20 25 30 35 40
DS2114
-
Rev 11 page 6/18
Document Outline 1 Characteristics 1.1 Characteristics (curves) 2 Package information 2.1 TO-220AB Insulated and non Insulated package information 2.1.1 TO-220AB Insulated and non Insulated package information 2.2 D²PAK package information 2.2.1 D²PAK package information 3 Ordering information 3.1 Product selector 3.2 Ordering information Revision history