Datasheet MC10EL16, MC100EL16 (ON Semiconductor) - 2
| Hersteller | ON Semiconductor |
| Beschreibung | 5.0 V ECL Differential Receiver |
| Seiten / Seite | 9 / 2 — MC10EL16, MC100EL16. Table 2. ATTRIBUTES. Characteristics. Value. Table … |
| Revision | 10 |
| Dateiformat / Größe | PDF / 258 Kb |
| Dokumentensprache | Englisch |
MC10EL16, MC100EL16. Table 2. ATTRIBUTES. Characteristics. Value. Table 3. MAXIMUM RATINGS. Symbol. Parameter. Condition 1. Condition 2
Modelllinie für dieses Datenblatt
Textversion des Dokuments
link to page 2
MC10EL16, MC100EL16 Table 2. ATTRIBUTES Characteristics Value
Internal Input Pulldown Resistor 75 KW Internal Input Pullup Resistor N/A ESD Protection Human Body Model > 500 V Machine Model > 100 V Charge Device Model > 2 KV Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb-Free Pkg SOIC−8 NB Level 1 TSSOP−8 Level 3 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Transistor Count 47 Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Units
VCC PECL Mode Power Supply VEE = 0 V 8 V VEE NECL Mode Power Supply VCC = 0 V −8 V VI PECL Mode Input Voltage VEE = 0 V VI ≤ VCC 6 V NECL Mode Input Voltage VCC = 0 V VI ≥ VEE −6 Iout Output Current Continuous 50 mA Surge 100 IBB VBB Sink/Source ±0.5 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm SOIC−8 NB 190 °C/W 500 lfpm SOIC−8 NB 130 qJC Thermal Resistance (Junction-to-Case) Standard Board SOIC−8 NB 41 to 44 °C/W qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm TSSOP−8 185 °C/W 500lfpm TSSOP−8 140 qJC Thermal Resistance (Junction-to-Case) Standard Board TSSOP−8 41 to 44 ±5% °C/W Tsol Wave Solder (Pb-Free) < 2 to 3 sec @ 260°C 265 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
www.onsemi.com 2
MC10EL16, MC100EL16 Table 2. ATTRIBUTES Characteristics Value
Internal Input Pulldown Resistor 75 KW Internal Input Pullup Resistor N/A ESD Protection Human Body Model > 500 V Machine Model > 100 V Charge Device Model > 2 KV Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb-Free Pkg SOIC−8 NB Level 1 TSSOP−8 Level 3 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Transistor Count 47 Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Units
VCC PECL Mode Power Supply VEE = 0 V 8 V VEE NECL Mode Power Supply VCC = 0 V −8 V VI PECL Mode Input Voltage VEE = 0 V VI ≤ VCC 6 V NECL Mode Input Voltage VCC = 0 V VI ≥ VEE −6 Iout Output Current Continuous 50 mA Surge 100 IBB VBB Sink/Source ±0.5 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm SOIC−8 NB 190 °C/W 500 lfpm SOIC−8 NB 130 qJC Thermal Resistance (Junction-to-Case) Standard Board SOIC−8 NB 41 to 44 °C/W qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm TSSOP−8 185 °C/W 500lfpm TSSOP−8 140 qJC Thermal Resistance (Junction-to-Case) Standard Board TSSOP−8 41 to 44 ±5% °C/W Tsol Wave Solder (Pb-Free) < 2 to 3 sec @ 260°C 265 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
www.onsemi.com 2