Datasheet GD32E507xx (GigaDevice) - 6

link to page 9 link to page 14 link to page 20 link to page 30 link to page 38 link to page 55 link to page 55 link to page 56 link to page 56 link to page 56 link to page 57 link to page 57 link to page 64 link to page 66 link to page 66 link to page 67 link to page 67 link to page 68 link to page 68 link to page 68 link to page 69 link to page 70 link to page 70 link to page 71 link to page 71 link to page 72 link to page 72 link to page 72 link to page 73 link to page 73 link to page 74 link to page 75 link to page 75 link to page 76 link to page 76 link to page 77 link to page 77 link to page 77 link to page 78 link to page 79 GD32E507xx Datasheet
List of Tables Table 2-1. GD32E507xx devices features and peripheral list .. 8 Table 2-2. GD32E507xx memory map .. 13 Table 2-3. GD32E507Zx LQFP144 pin definitions ... 19 Table 2-4. GD32E507Vx LQFP100 pin definitions .. 29 Table 2-5. GD32E507Rx LQFP64 pin definitions .. 37 Table 4-1. Absolute maximum ratings (1)(4) .. 54 Table 4-2. DC operating conditions ... 54 Table 4-3. Clock frequency (1) ... 55 Table 4-4. Operating conditions at Power up/ Power down (1) .. 55 Table 4-5. Start-up timings of Operating conditions (1)(2)(3) .. 55 Table 4-6. Power saving mode wakeup timings characteristics (1)(2) .. 56 Table 4-7. Power consumption characteristics (2)(3)(4)(5) ... 56 Table 4-8. Peripheral current consumption characteristics (1) .. 63 Table 4-9. EMS characteristics (1) ... 65 Table 4-10. Power supply supervisor characteristics.. 65 Table 4-11. ESD characteristics (1) ... 66 Table 4-12. Static latch-up characteristics (1) .. 66 Table 4-13. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics . 67 Table 4-14. High speed external clock characteristics (HXTAL in bypass mode) .. 67 Table 4-15. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics .. 67 Table 4-16. Low speed external user clock characteristics (LXTAL in bypass mode) ... 68 Table 4-17. High speed internal clock (IRC8M) characteristics .. 69 Table 4-18. Low speed internal clock (IRC40K) characteristics ... 69 Table 4-19. High speed internal clock (IRC48M) characteristics .. 70 Table 4-20. PLL characteristics .. 70 Table 4-21. PLL1 characteristics .. 71 Table 4-22. PLL2 characteristics .. 71 Table 4-23. PLLUSB characteristics .. 71 Table 4-24. Flash memory characteristics .. 72 Table 4-25. NRST pin characteristics .. 72 Table 4-26. I/O port DC characteristics (1)(3) ... 73 Table 4-27. I/O port AC characteristics (1)(2) ... 74 Table 4-28. Temperature sensor characteristics (1) .. 74 Table 4-29. ADC characteristics ... 75 Table 4-30. ADC RAIN max for fADC = 35 MHz .. 75 Table 4-31. ADC dynamic accuracy at fADC = 14 MHz (1) ... 76 Table 4-32. ADC dynamic accuracy at fADC = 35 MHz (1) ... 76 Table 4-33. ADC static accuracy at fADC = 14 MHz (1) .. 76 Table 4-34. DAC characteristics ... 77 Table 4-35. CMP characteristics (1) ... 78
5 Document Outline Table of Contents List of Figures List of Tables 1. General description 2. Device overview 2.1. Device information 2.2. Block diagram 2.3. Pinouts and pin assignment 2.4. Memory map 2.5. Clock tree 2.6. Pin definitions 2.6.1. GD32E507Zx LQFP144 pin definitions 2.6.2. GD32E507Vx LQFP100 pin definitions 2.6.3. GD32E507Rx LQFP64 pin definitions 3. Functional description 3.1. Arm® Cortex®-M33 core 3.2. Embedded memory 3.3. Clock, reset and supply management 3.4. Boot modes 3.5. Power saving modes 3.6. Analog to digital converter (ADC) 3.7. Digital to analog converter (DAC) 3.8. DMA 3.9. General-purpose inputs/outputs (GPIOs) 3.10. Timers and PWM generation 3.11. Real time clock (RTC) 3.12. Inter-integrated circuit (I2C) 3.13. Serial peripheral interface (SPI) 3.14. Universal synchronous asynchronous receiver transmitter (USART) 3.15. Inter-IC sound (I2S) 3.16. Universal serial bus High-Speed interface (USBHS) 3.17. Controller area network (CAN) 3.18. Ethernet (ENET) 3.19. External memory controller (EXMC) 3.20. Comparators (CMP) 3.21. Trigonometric Math Unit (TMU) 3.22. Super High-Resolution Timer (SHRTIMER) 3.23. Serial/Quad Parallel Interface (SQPI) 3.24. Debug mode 3.25. Package and operation temperature 4. Electrical characteristics 4.1. Absolute maximum ratings 4.2. Operating conditions characteristics 4.3. Power consumption 4.4. EMC characteristics 4.5. Power supply supervisor characteristics 4.6. Electrical sensitivity 4.7. External clock characteristics 4.8. Internal clock characteristics 4.9. PLL characteristics 4.10. Memory characteristics 4.11. NRST pin characteristics 4.12. GPIO characteristics 4.13. Temperature sensor characteristics 4.14. ADC characteristics 4.15. DAC characteristics 4.16. Comparators characteristics 4.17. Trigonometric Math Unit (TMU) characteristics 4.18. I2C characteristics 4.19. SPI characteristics 4.20. I2S characteristics 4.21. USART characteristics 4.22. CAN characteristics 4.23. USBHS characteristics 4.24. EXMC characteristics 4.25. Serial/Quad Parallel Interface (SQPI) characteristics 4.26. Super High-Resolution Timer (SHRTIMER) characteristics 4.27. TIMER characteristics 4.28. WDGT characteristics 4.29. Parameter condition 5. Package information 5.1. LQFP144 package outline dimensions 5.2. LQFP100 package outline dimensions 5.3. LQFP64 package outline dimensions 6. Ordering information 7. Revision history