Datasheet 74HCU04 (Nexperia) - 10
| Hersteller | Nexperia |
| Beschreibung | Hex unbuffered inverter |
| Seiten / Seite | 14 / 10 — Nexperia. 74HCU04. Hex unbuffered inverter. TSSOP14: plastic thin shrink … |
| Revision | 31052021 |
| Dateiformat / Größe | PDF / 259 Kb |
| Dokumentensprache | Englisch |
Nexperia. 74HCU04. Hex unbuffered inverter. TSSOP14: plastic thin shrink smal outline package; 14 leads; body width 4.4 mm
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Nexperia 74HCU04 Hex unbuffered inverter TSSOP14: plastic thin shrink smal outline package; 14 leads; body width 4.4 mm SOT402-1
D E A X c y H E v M A Z 14 8 Q A 2 (A 3) A A 1 pin 1 index θ L p L 1 7 detail X w M b e p 0 2.5 5 mm scale
DIMENSIONS (mm are the original dimensions) UNIT A A 1 A 2 A 3 b p c D (1) E (2) (1) e H E L L p Q v w y Z
θ
max.
o mm 0.15 0.95 0.30 0.2 5.1 4.5 0.75 0.4 0.72 8 1.1 0.05 0.80 0.25 0.19 0.1 4.9 4.3 0.65 6.6 6.2 1 0.50 0.3 0.2 0.13 0.1 0.38 0 o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES OUTLINE EUROPEAN VERSION PROJECTION ISSUE DATE IEC JEDEC JEITA
SOT402-1 MO-153 99-12-27 03-02-18
Fig. 18. Package outline SOT402-1 (TSSOP14)
74HCU04 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2021. Al rights reserved
Product data sheet Rev. 9 — 31 May 2021 10 / 14
Document Outline 1. General description 2. Features and benefits 3. Ordering information 4. Functional diagram 5. Pinning information 5.1. Pinning 5.2. Pin description 6. Functional description 7. Limiting values 8. Recommended operating conditions 9. Static characteristics 10. Dynamic characteristics 10.1. Waveform and test circuit 11. Typical transfer characteristics 12. Application information 13. Package outline 14. Abbreviations 15. Revision history 16. Legal information Contents
D E A X c y H E v M A Z 14 8 Q A 2 (A 3) A A 1 pin 1 index θ L p L 1 7 detail X w M b e p 0 2.5 5 mm scale
DIMENSIONS (mm are the original dimensions) UNIT A A 1 A 2 A 3 b p c D (1) E (2) (1) e H E L L p Q v w y Z
θ
max.
o mm 0.15 0.95 0.30 0.2 5.1 4.5 0.75 0.4 0.72 8 1.1 0.05 0.80 0.25 0.19 0.1 4.9 4.3 0.65 6.6 6.2 1 0.50 0.3 0.2 0.13 0.1 0.38 0 o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES OUTLINE EUROPEAN VERSION PROJECTION ISSUE DATE IEC JEDEC JEITA
SOT402-1 MO-153 99-12-27 03-02-18
Fig. 18. Package outline SOT402-1 (TSSOP14)
74HCU04 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2021. Al rights reserved
Product data sheet Rev. 9 — 31 May 2021 10 / 14
Document Outline 1. General description 2. Features and benefits 3. Ordering information 4. Functional diagram 5. Pinning information 5.1. Pinning 5.2. Pin description 6. Functional description 7. Limiting values 8. Recommended operating conditions 9. Static characteristics 10. Dynamic characteristics 10.1. Waveform and test circuit 11. Typical transfer characteristics 12. Application information 13. Package outline 14. Abbreviations 15. Revision history 16. Legal information Contents