Datasheet MAX17291 (Maxim) - 6

HerstellerMaxim
BeschreibungHigh-Voltage, 1A Micropower Boost Converter with Short-Circuit Protection and True Shutdown
Seiten / Seite21 / 6 — Absolute Maximum Ratings. Package Information. WLP. Thermal Resistance, …
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DokumentenspracheEnglisch

Absolute Maximum Ratings. Package Information. WLP. Thermal Resistance, Four-Layer Board:. TDFN. Electrical Characteristics

Absolute Maximum Ratings Package Information WLP Thermal Resistance, Four-Layer Board: TDFN Electrical Characteristics

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link to page 8 MAX17291 High-Voltage, 1A Micropower Boost Converter with Short-Circuit Protection and True Shutdown
Absolute Maximum Ratings
EN, IN to GND .. -0.3V to +6V TDFN Continuous Power Dissipation (TA = +70°C, derate FB, POK to GND .. -0.3V to +6V 11.7mW/°C above +70°C) ...937.9mW OUT, LX to GND... -0.3V to +22V Operating Temperature Range ...-40°C to +125°C AGND to GND ... -0.3V to +0.3V Maximum Junction Temperature ..+150°C LX RMS Current WLP ... -1.6ARMS to +1.6ARMS Storage Temperature Range ..-65°C to +150°C LX RMS Current TDFN.. -1.0ARMS to +1.0ARMS Lead Temperature (soldering, 10s)...+300°C WLP Continuous Power Dissipation (TA = +70°C, derate Soldering Temperature (reflow) ..+260°C 10.51mW/°C above +70°C) .. 840mW Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information WLP
Package Code N60N1+1 Outline Number 21-100386 Land Pattern Number Refer to Application Note 1891
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 95.15°C/W Junction to Case (θJC) N/A
TDFN
Package Code T822+3C Outline Number 21-0168 Land Pattern Number 90-0065
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 85.3°C/W Junction to Case (θJC) 8.9°C/W For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(VIN = VEN = 3.6V, VOUT = 12V, TJ = -40°C to +125°C, typical values are at TJ = +25°C, unless otherwise noted. (Note 1))
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Input Voltage Range VIN Guaranteed by LX minimum off-time 1.8 5.5 V Input Undervoltage V Threshold UVLO VIN rising 1.7 1.8 V Input Undervoltage V Hysteresis UVLO_HYS 100 mV Output Voltage Range VOUT VIN < VOUT_TARGET 5.5 20 V www.maximintegrated.com Maxim Integrated | 6 Document Outline General Description Applications Benefits and Features Typical Application Circuit Absolute Maximum Ratings Package Information WLP TDFN Electrical Characteristics Electrical Characteristics (continued) Typical Operating Characteristics Typical Operating Characteristics (continued) Pin Configurations WLP TDFN Pin Description Functional Diagram Functional Block Diagram Detailed Description Undervoltage Lockout Enable and Disable Soft-Start Output Short-Circuit Protection Thermal Shutdown Device Functional Modes Light Load Efficiency Mode PWM Mode Applications Information Typical Application Design Requirements Detailed Design Procedure Programming the Output Voltage Inductor Selection Input and Output Capacitor Selection Layout Guidelines Ordering Information Revision History