Datasheet LTM8051 (Analog Devices) - 2
| Hersteller | Analog Devices |
| Beschreibung | Quad 40VIN Silent Switcher μModule Regulator with Configurable 1.2A Output Array |
| Seiten / Seite | 28 / 2 — ABSOLUTE MAXIMUM RATINGS (Note 1). PIN CONFIGURATION. ORDER INFORMATION. … |
| Dateiformat / Größe | PDF / 2.6 Mb |
| Dokumentensprache | Englisch |
ABSOLUTE MAXIMUM RATINGS (Note 1). PIN CONFIGURATION. ORDER INFORMATION. PART MARKING*. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER
Modelllinie für dieses Datenblatt
Textversion des Dokuments
LTM8051
ABSOLUTE MAXIMUM RATINGS (Note 1)
SYNCn ...6V VINn, RUNn, PGn ..42V Maximum Internal Temperature (Note 2) .. 125°C VOUTn, BIASn ...10V Storage Temperature ... –55°C to 125°C FBn, TRSSn, SHAREn , RTn, VCCn ...4V Peak Solder Reflow Package Body Temperature ..260°C
PIN CONFIGURATION
TOP VIEW RUN23 RUN14 VIN1 VIN4 PG3 PG4 7 BANK2 BANK4 V CLKOUT23 CLKOUT14 SYNC23 OUT2 SYNC14 PG2 PG1 VOUT4 6 BIAS23 SHARE14 5 VCC23 BANK6 VCC14 4 SHARE23 GND BIAS14 3 TRSS2 FB2 TRSS1 TRSS4 FB1 2 BANK3 BANK1 V TRSS3 FB3 RT23 RT14 FB4 OUT3 V BANK5 OUT1 1 VIN23 A B C D E F G H J K L M N BGA PACKAGE 91-LEAD (11.25mm × 6.25mm × 2.22mm) TJMAX = 125°C, θJA = 16°C/W, θJCtop = 11.4°C/W, θJCbot = 3.5°C/W, WEIGHT = 0.42g θ VALUES DETERMINED PER JEDEC 51-9, 51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM8051EY#PBF SAC305 (RoHS) e1 LTM8051IY#PBF LTM8051Y BGA 3 –40°C to 125°C LTM8051IY SnPb (63/37) e0 • Device temperature grade is indicated by a label on the shipping container. • This product is not recommended for second side reflow. • Pad or ball finish code is per IPC/JEDEC J-STD-609. This product is moisture sensitive. For more information, go to Recommended BGA PCB Assembly and Manufacturing Procedures. • BGA Package and Tray Drawings Rev. 0 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Package Photo Design Resources Related Parts
ABSOLUTE MAXIMUM RATINGS (Note 1)
SYNCn ...6V VINn, RUNn, PGn ..42V Maximum Internal Temperature (Note 2) .. 125°C VOUTn, BIASn ...10V Storage Temperature ... –55°C to 125°C FBn, TRSSn, SHAREn , RTn, VCCn ...4V Peak Solder Reflow Package Body Temperature ..260°C
PIN CONFIGURATION
TOP VIEW RUN23 RUN14 VIN1 VIN4 PG3 PG4 7 BANK2 BANK4 V CLKOUT23 CLKOUT14 SYNC23 OUT2 SYNC14 PG2 PG1 VOUT4 6 BIAS23 SHARE14 5 VCC23 BANK6 VCC14 4 SHARE23 GND BIAS14 3 TRSS2 FB2 TRSS1 TRSS4 FB1 2 BANK3 BANK1 V TRSS3 FB3 RT23 RT14 FB4 OUT3 V BANK5 OUT1 1 VIN23 A B C D E F G H J K L M N BGA PACKAGE 91-LEAD (11.25mm × 6.25mm × 2.22mm) TJMAX = 125°C, θJA = 16°C/W, θJCtop = 11.4°C/W, θJCbot = 3.5°C/W, WEIGHT = 0.42g θ VALUES DETERMINED PER JEDEC 51-9, 51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM8051EY#PBF SAC305 (RoHS) e1 LTM8051IY#PBF LTM8051Y BGA 3 –40°C to 125°C LTM8051IY SnPb (63/37) e0 • Device temperature grade is indicated by a label on the shipping container. • This product is not recommended for second side reflow. • Pad or ball finish code is per IPC/JEDEC J-STD-609. This product is moisture sensitive. For more information, go to Recommended BGA PCB Assembly and Manufacturing Procedures. • BGA Package and Tray Drawings Rev. 0 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Package Photo Design Resources Related Parts