Datasheet HMC713MS8, 713MS8E (Analog Devices) - 6
| Hersteller | Analog Devices |
| Beschreibung | 54 dB, LOGARITHMIC DETECTOR / CONTROLLER, 45 - 2700 MHz |
| Seiten / Seite | 10 / 6 — HMC713MS8 / 713MS8E. 54 DB, LOGARITHMIC. DETECTOR / CONTROLLER, 45 - 2700 … |
| Dateiformat / Größe | PDF / 956 Kb |
| Dokumentensprache | Englisch |
HMC713MS8 / 713MS8E. 54 DB, LOGARITHMIC. DETECTOR / CONTROLLER, 45 - 2700 MHz. Absolute Maximum Ratings. Outline Drawing
Modelllinie für dieses Datenblatt
Textversion des Dokuments
HMC713MS8 / 713MS8E
v06.0412
54 DB, LOGARITHMIC DETECTOR / CONTROLLER, 45 - 2700 MHz Absolute Maximum Ratings
Vcc 0 to +5.6V eN 0 to +5.6V ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS t Vset 0 to +5.6V M oUt output current 5 mA oUtN output current 5 mA s - RF Input Power 12 dBm Junction temperature 125 °c rs continuous Pdiss (t = 85°c) 0.22 watts (Derate 5.43 mw/°c above 85°c) o thermal resistance (r ) t th 184 °c/w (junction to lead) c storage temperature -65 to +150 °c e operating temperature -40 to +85 °c t e esD sensitivity (HBM) class 1c D
Outline Drawing
r e w o P Notes: 1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED. 2. LEAD MATERIAL: COPPER ALLOY 3. LEAD PLATING: 100% MATTE TIN 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 7. ALL GroUND LeADs MUst Be soLDereD to PcB rF GroUND.
Package Information
Part Number Package Body Material Lead Finish MsL rating Package Marking [3] HMc713Ms8 Low Stress Injection Molded Plastic sn/Pb solder MsL1 [1] H713 XXXX HMc713Ms8e RoHS-compliant Low Stress Injection Molded Plastic 100% matte sn MsL1 [2] H713 XXXX [1] Max peak reflow temperature of 235 °c [2] Max peak reflow temperature of 260 °c [3] 4-Digit lot number XXXX I F nf o or r p mati r o in cfe ur , d nish e e l d iv b e y r A y a nalo n g d t Devi o p ces i la s c bele o ieve rd d t e o rbs e : H acc iutrtatite e M and ic reli rao bl w e. a H v o e C wever o , nrp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No rd Phoe n r O e: 7 n- 81-li 3 n 2 e a 9-4 t w 70 ww 0 • O . rdh e itt r o it nle i . n co e a m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. t www.analog.com
6
Application Support: Phon Trademarks and registered trademarks are the property of their respective owners. e: 978-250-334 A 3 o pplic r a atio pp n S s u @ p h por ittti : Pte. ho c n o e m : 1-800-ANALOG-D
v06.0412
54 DB, LOGARITHMIC DETECTOR / CONTROLLER, 45 - 2700 MHz Absolute Maximum Ratings
Vcc 0 to +5.6V eN 0 to +5.6V ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS t Vset 0 to +5.6V M oUt output current 5 mA oUtN output current 5 mA s - RF Input Power 12 dBm Junction temperature 125 °c rs continuous Pdiss (t = 85°c) 0.22 watts (Derate 5.43 mw/°c above 85°c) o thermal resistance (r ) t th 184 °c/w (junction to lead) c storage temperature -65 to +150 °c e operating temperature -40 to +85 °c t e esD sensitivity (HBM) class 1c D
Outline Drawing
r e w o P Notes: 1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC SILICA AND SILICON IMPREGNATED. 2. LEAD MATERIAL: COPPER ALLOY 3. LEAD PLATING: 100% MATTE TIN 4. DIMENSIONS ARE IN INCHES [MILLIMETERS]. 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 7. ALL GroUND LeADs MUst Be soLDereD to PcB rF GroUND.
Package Information
Part Number Package Body Material Lead Finish MsL rating Package Marking [3] HMc713Ms8 Low Stress Injection Molded Plastic sn/Pb solder MsL1 [1] H713 XXXX HMc713Ms8e RoHS-compliant Low Stress Injection Molded Plastic 100% matte sn MsL1 [2] H713 XXXX [1] Max peak reflow temperature of 235 °c [2] Max peak reflow temperature of 260 °c [3] 4-Digit lot number XXXX I F nf o or r p mati r o in cfe ur , d nish e e l d iv b e y r A y a nalo n g d t Devi o p ces i la s c bele o ieve rd d t e o rbs e : H acc iutrtatite e M and ic reli rao bl w e. a H v o e C wever o , nrp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No rd Phoe n r O e: 7 n- 81-li 3 n 2 e a 9-4 t w 70 ww 0 • O . rdh e itt r o it nle i . n co e a m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. t www.analog.com
6
Application Support: Phon Trademarks and registered trademarks are the property of their respective owners. e: 978-250-334 A 3 o pplic r a atio pp n S s u @ p h por ittti : Pte. ho c n o e m : 1-800-ANALOG-D