Datasheet HMC408LP3, 408LP3E (Analog Devices) - 4
| Hersteller | Analog Devices |
| Beschreibung | GaAs InGaP HBT MMIC 1 WATT POWER AMPLIFIER, 5.1 - 5.9 GHz |
| Seiten / Seite | 8 / 4 — HMC408LP3 / 408LP3E. GaAs InGaP HBT MMIC 1 WATT. POWER AMPLIFIER, 5.1 - … |
| Dateiformat / Größe | PDF / 388 Kb |
| Dokumentensprache | Englisch |
HMC408LP3 / 408LP3E. GaAs InGaP HBT MMIC 1 WATT. POWER AMPLIFIER, 5.1 - 5.9 GHz. Typical Supply Current
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Textversion des Dokuments
HMC408LP3 / 408LP3E
v03.0705
GaAs InGaP HBT MMIC 1 WATT POWER AMPLIFIER, 5.1 - 5.9 GHz Typical Supply Current Absolute Maximum Ratings vs. Vs= Vcc1 + Vcc2
Collector Bias Voltage (Vcc1, Vcc2) +5.5 Vdc Vs (V) Icq (mA) Control Voltage (Vpd) +5.5 Vdc 4.75 725 RF Input Power (RFIN)(Vs = Vpd = +5Vdc) +20 dBm 5.0 750 Junction Temperature 150
°
C 5.25 780 Note: Amplifi er will operate over full voltage range shown above Continuous Pdiss (T = 85
°
C) 4.71 W (derate 72.5 mW/
°
C above 85
°
C) Thermal Resistance 13.8
°
C/W (junction to ground paddle) 11 Storage Temperature -65 to +150
°
C ELECTROSTATIC SENSITIVE DEVICE Operating Temperature -40 to +85
°
C OBSERVE HANDLING PRECAUTIONS T
Outline Drawing
- SM S R IE IF L P M R A E W O NOTES: & P 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] R 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE A 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. E PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. IN 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE L SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] 408 HMC408LP3 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] 408 HMC408LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 XXXX [1] Max peak refl ow temperature of 235 °C [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX Information furnish F e o d r pri by An ce, de alog Devic leis vie s rbyeli, a eve nd to pla d to be accur ce o ate an r d der relia s ble , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. : 978 Pho - n 25 e: 7 0- 81 33 2 4 9- 3 F 470 ax: 978 0 • Order o - n 25 lin 0 e a-t 3373 www.analog.com
11 - 37
Order On- Trademarks and registered trademarks are the property of their respective owners. line at www.hi A tptipte.co licatio m n Support: Phone: 1-800-ANALOG-D
v03.0705
GaAs InGaP HBT MMIC 1 WATT POWER AMPLIFIER, 5.1 - 5.9 GHz Typical Supply Current Absolute Maximum Ratings vs. Vs= Vcc1 + Vcc2
Collector Bias Voltage (Vcc1, Vcc2) +5.5 Vdc Vs (V) Icq (mA) Control Voltage (Vpd) +5.5 Vdc 4.75 725 RF Input Power (RFIN)(Vs = Vpd = +5Vdc) +20 dBm 5.0 750 Junction Temperature 150
°
C 5.25 780 Note: Amplifi er will operate over full voltage range shown above Continuous Pdiss (T = 85
°
C) 4.71 W (derate 72.5 mW/
°
C above 85
°
C) Thermal Resistance 13.8
°
C/W (junction to ground paddle) 11 Storage Temperature -65 to +150
°
C ELECTROSTATIC SENSITIVE DEVICE Operating Temperature -40 to +85
°
C OBSERVE HANDLING PRECAUTIONS T
Outline Drawing
- SM S R IE IF L P M R A E W O NOTES: & P 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] R 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE A 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. E PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. IN 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE L SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] 408 HMC408LP3 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] 408 HMC408LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 XXXX [1] Max peak refl ow temperature of 235 °C [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX Information furnish F e o d r pri by An ce, de alog Devic leis vie s rbyeli, a eve nd to pla d to be accur ce o ate an r d der relia s ble , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. : 978 Pho - n 25 e: 7 0- 81 33 2 4 9- 3 F 470 ax: 978 0 • Order o - n 25 lin 0 e a-t 3373 www.analog.com
11 - 37
Order On- Trademarks and registered trademarks are the property of their respective owners. line at www.hi A tptipte.co licatio m n Support: Phone: 1-800-ANALOG-D