Datasheet HMC1086F10 (Analog Devices) - 8

HMC1086F10
v06.1017
25 WATT FlAnge MounT gAn MMIC PoW 10-Lead Ceramic Leaded Chip Carrier [LDCC]eR AMPlIFIeR, 2 - 6 gHz (EJ-10-1) Dimensions shown in inches outline Drawing 0.450 0.042
T
0.053
m s
0.116 PIN 1 0.075 INDICATOR 0.138 1 10
r -
0.288
e
0.010
w
0.388 0.350 SQ
o
0.682
p
0.576 0.050 5 6
r & A
Ø 0.070
e
TOP VIEW 0.100 0.025
lin
SIDE VIEW 0.342 0.053 16
s -
PKG-0051 04-14-2016-A
r 10-lead Ceramic leaded Chip Carrier [lDCC] ie (eJ-10-1) Dimensions shown in inches lif p m A
Package Information
part number package Body material lead finish msl rating package marking [1] HmC1086f10 Copper 15 Tungston 85 niAu n/A [2] H1086 XXXX [1] 4-Digit lot number XXXX [2] This device is not rated for moisture sensitivity level. The HmC1086f10 is a non-hermetic, air cavity device which is not surface mountable and is not intended nor suitable to be used in a solder reflow process. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
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Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Performance Characteristics Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature Low Frequency Gain & Return Loss Noise Figure vs. Frequency P1dB vs. Temperature Psat vs. Temperature P1dB vs. Vdd Psat vs. Vdd Output IP3 vs. Temperature @ Pout = 18 dBm Tone Power Compression @ 10 GHz Power Dissipation Second Harmonics vs. Temperature @ Pout = 18 dBm Second Harmonics vs. Vdd @ Pout = 18 dBm Second Harmonics vs. Pout Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Die Packaging Information Pad Descriptions Assembly Diagram Application Circuit