Datasheet HMC1087F10 (Analog Devices) - 8

HMC1087F10
v04.1217
8 WATT Flange Mount GaN MMIC POWER AMPLIFIER, 2 - 20 GHz 10-Lead Ceramic Leaded Chip Carrier [LDCC] (EJ-10-1) Dimensions shown in inches Outline Drawing 0.450
T
0.042
m
0.053
s
0.116 PIN 1 0.075 INDICATOR 0.138
r -
1 10 0.288
e w
0.010 0.388
o
0.682 0.350 SQ
p
0.576 0.050
r &
5 6
A
Ø 0.070
e
TOP VIEW
lin
0.100 0.025 SIDE VIEW 0.342 0.053
s -
16
r
PKG-0051 04-14-2016-A
ie 10-lead Ceramic leaded Chip Carrier [lDCC] (eJ-10-1) Dimensions shown in inches. lif p m A
Package Information
part number package Body material lead finish msl rating package marking [1] HmC1087f10 Copper 15 Tungston 85 niAu n/A [2] H1087 XXXX [1] 4-Digit lot number XXXX [2] This device is not rated for moisture sensitivity level. The HmC1087f10 is a non-hermetic, air cavity device which is not surface mountable and is not intended nor suitable to be used in a solder reflow process. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
8
Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Performance Characteristics Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature Low Frequency Gain & Return Loss Noise Figure vs. Frequency P1dB vs. Temperature Psat vs. Temperature P1dB vs. Vdd Psat vs. Vdd Output IP3 vs. Temperature @ Pout = 18 dBm Tone Power Compression @ 10 GHz Power Dissipation Second Harmonics vs. Temperature @ Pout = 18 dBm Second Harmonics vs. Vdd @ Pout = 18 dBm Second Harmonics vs. Pout Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Die Packaging Information Pad Descriptions Assembly Diagram Application Circuit