Datasheet HMC637A (Analog Devices) - 5

HMC637A
v01.0715
GaAs MMIC 1 WATT POWER AMPLIFIER DC - 6 GHz Outline Drawing
IP H R - C E W O R & P A E IN S - L R IE LIF P M A
Die Packaging Information
[1] NOTES: 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] Standard Alternate 2. DIE THICKNESS IS 0.004 (0.100) 3. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE GP-1 (Gel Pack) [2] 4. BOND PAD METALIZATION: GOLD [1] Refer to the “Packaging Information” section for die 5. BACKSIDE METALLIZATION: GOLD packaging dimensions. 6. BACKSIDE METAL IS GROUND 7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS [2] For alternate packaging information contact Hittite 8. OVERALL DIE SIZE IS ±.002 Microwave Corporation. Informat F io o n r p furn risihcee d , d by e An lialvoe g rDy a evic n e d t s is o p belie lva e c d t e o o b rd e a e cc rursa: A te a n n a d lo reli g D able. e H v o ic weveers, I no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other nc., 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 • Fax: 978-250-3373 • O rights of third parties that may result from its use. Specifications subject to change without notice. No rd Ph e o r O ne n : 7 -l 81 i-n 3 e a 29-4t w 70 ww 0 • O .h rd iettit r o e nli.c n om
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license is granted by implication or otherwise under any patent or patent rights of Analog Devices. e at www.analog.com Application Support: Pho Trademarks and registered trademarks are the property of their respective owners.ne: 978-250-33A4 p3 p o lic ra a tiopp n S su@ p h po irtttit : Pe. hocnom e: 1-800-ANALOG-D