Datasheet HMC7229 (Analog Devices) - 8

HMC7229 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 30 30 S21 –55°C +25°C 20 28 +85°C 10 ) 26 B 0 B) SE (d d N 24 S11 N ( AI –10 G ESPO R S22 22 –20 20 –30 –40 18 32 33 34 35 36 37 38 39 40 41 33 34 35 36 37 38 39 40
-013 -010
FREQUENCY (GHz) FREQUENCY (GHz)
14566 14566 Figure 10. Response Gain and Return Loss vs. Frequency Figure 13. Gain vs. Frequency at Various Temperatures
0 0 –5 –55°C –55°C ) B) –5 d B +25°C +25°C ( (d +85°C S +85°C S –10 SS O O L N R –10 URN L –15 T TU RE RE UT UT P –20 UT INP –15 O –25 –20 –30
1
33 34 35 36 37 38 39 40
1 -014 -0
33 34 35 36 37 38 39 40 FREQUENCY (GHz) FREQUENCY (GHz)
14566 14566 Figure 11. Input Return Loss vs. Frequency at Various Temperatures Figure 14. Output Return Loss vs. Frequency at Various Temperatures
34 34 –55°C 32 +25°C 32 5.0V +85°C 5.5V 6.0V 30 30 Bm) Bm) d d B ( B ( 1d 1d P 28 P 28 26 26 24 24 33 34 35 36 37 38 39 40
-012
33 34 35 36 37 38 39 40
-015
FREQUENCY (GHz) FREQUENCY (GHz)
14566 14566 Figure 12. P1dB vs. Frequency at Various Temperatures Figure 15. P1dB vs. Frequency at Various Supply Voltages Rev. D | Page 8 of 16 Document Outline Features Applications General Description Functional Block Diagram Table of Contents Revision History Specifications 33 GHz to 35 GHz Frequency Range 35 GHz to 37 GHz Frequency Range 37 GHz to 40 GHz Frequency Range Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Biasing Procedures Typical Application Circuit Mounting and Bonding Techniques for Millimeter Wave GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding Assembly Diagram Outline Dimensions Ordering Guide