Datasheet HMC1144 (Analog Devices) - 8
| Hersteller | Analog Devices |
| Beschreibung | 35 GHz to 70 GHz, GaAs, pHEMT, MMIC, Medium Power Amplifier |
| Seiten / Seite | 16 / 8 — HMC1144. Data Sheet. 2.5V. 3.0V. 3.5V. 4.0V. –10. –15. –20. –25. … |
| Revision | D |
| Dateiformat / Größe | PDF / 351 Kb |
| Dokumentensprache | Englisch |
HMC1144. Data Sheet. 2.5V. 3.0V. 3.5V. 4.0V. –10. –15. –20. –25. FREQUENCY (GHz). +85°C. +25°C. –55°C. ) B. (d N. –30. –40. ISO. –50. EVER R. –60. –70. –80. 200mA. 250mA
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HMC1144 Data Sheet 0 0 2.5V 2.5V 3.0V 3.0V 3.5V 3.5V –5 4.0V 4.0V –5 B) B) (d (d S –10 S –10 S S O O L L N N UR –15 UR –15 T T RE RE –20 –20 –25
6
–25
9
30 36 42 48 54 60 66 72
31
30 36 42 48 54 60 66 72
31 3- 3-
FREQUENCY (GHz)
1314
FREQUENCY (GHz)
1314 Figure 16. Input Return Loss vs. Frequency for Various VDD at IDD = 250 mA Figure 19. Output Return Loss vs. Frequency for Various VDD at IDD = 250 mA
0 0 +85°C +85°C +25°C +25°C –55°C –10 –55°C –5 ) B –20 B) (d N (d IO –30 S –10 T S A O L L –40 N ISO UR –15 T SE –50 RE EVER R –60 –20 –70 –25
7
–80
0
30 36 42 48 54 60 66 72
31
30 36 42 48 54 60 66 72
32 3- 3-
FREQUENCY (GHz)
1314
FREQUENCY (GHz)
1314 Figure 17. Output Return Loss vs. Frequency at Various Temperatures Figure 20. Reverse Isolation vs. Frequency at Various Temperatures
0 24 200mA 250mA 320mA 20 –5 B) 16 (d ) S –10 S m O dB L ( 12 URN –15 1dB T P RE 8 –20 4 +85°C +25°C –55°C –25
8
0
1
30 36 42 48 54 60 66 72
31
30 36 42 48 54 60 66 72
32 3- 3-
FREQUENCY (GHz)
1314
FREQUENCY (GHz)
1314 Figure 18. Output Return Loss vs. Frequency for Various IDD at VDD = 4 V Figure 21. P1dB vs. Frequency at Various Temperatures Rev. D | Page 8 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY ELECTRICAL SPECIFICATIONS 35 GHz TO 40 GHz FREQUENCY RANGE 40 GHz TO 50 GHz FREQUENCY RANGE 50 GHz TO 70 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION ALTERNATE BIASING CONFIGURATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
6
–25
9
30 36 42 48 54 60 66 72
31
30 36 42 48 54 60 66 72
31 3- 3-
FREQUENCY (GHz)
1314
FREQUENCY (GHz)
1314 Figure 16. Input Return Loss vs. Frequency for Various VDD at IDD = 250 mA Figure 19. Output Return Loss vs. Frequency for Various VDD at IDD = 250 mA
0 0 +85°C +85°C +25°C +25°C –55°C –10 –55°C –5 ) B –20 B) (d N (d IO –30 S –10 T S A O L L –40 N ISO UR –15 T SE –50 RE EVER R –60 –20 –70 –25
7
–80
0
30 36 42 48 54 60 66 72
31
30 36 42 48 54 60 66 72
32 3- 3-
FREQUENCY (GHz)
1314
FREQUENCY (GHz)
1314 Figure 17. Output Return Loss vs. Frequency at Various Temperatures Figure 20. Reverse Isolation vs. Frequency at Various Temperatures
0 24 200mA 250mA 320mA 20 –5 B) 16 (d ) S –10 S m O dB L ( 12 URN –15 1dB T P RE 8 –20 4 +85°C +25°C –55°C –25
8
0
1
30 36 42 48 54 60 66 72
31
30 36 42 48 54 60 66 72
32 3- 3-
FREQUENCY (GHz)
1314
FREQUENCY (GHz)
1314 Figure 18. Output Return Loss vs. Frequency for Various IDD at VDD = 4 V Figure 21. P1dB vs. Frequency at Various Temperatures Rev. D | Page 8 of 16 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY ELECTRICAL SPECIFICATIONS 35 GHz TO 40 GHz FREQUENCY RANGE 40 GHz TO 50 GHz FREQUENCY RANGE 50 GHz TO 70 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION ALTERNATE BIASING CONFIGURATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE