HMC952ALP5GE v03.0418 GaAs pHEMT MMIC 2 Watt POWER AMPLIFIERWITH POWER DETECTOR 8 - 14 GHzPin Descriptions pin number function Description interface schematic T m 1-3, 9, 10, These pins are not connected internally, however all data s 14, 17-19, n/C shown herein was measured with these pins connected to 23, 24 rf/DC ground externally. r - e 4 rfin This pin is DC coupled and matched to 50 ohms. w o p These pins and package bottom must be connected to 5, 15 GnD rf/DC ground. r & A e Vgg1, Vgg2, Gate control for amplifier external bypass capacitors of 6-8 lin Vgg3 100pf, 10nf and 4.7uf are required. s - r ie Vdd4, Vdd3, Vdd2, Drain bias voltage for amplifier. external bypass capacitors 11, 20-22 Vdd1 of 100pf, 10nf and 4.7uf are required. lif p m DC bias of diode biased through external resistor , used 12 Vref for temperature compensation of Vdet. see application A circuit. DC voltage representing rf output power rectified by 13 Vdet diode which is biased through an external resistor. see application circut. 16 rfoUT This pin is AC coupled and matched to 50 ohms For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com 7 Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Performance Characteristics Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature Low Frequency Gain & Return Loss Noise Figure vs. Frequency P1dB vs. Temperature Psat vs. Temperature P1dB vs. Vdd Psat vs. Vdd Output IP3 vs. Temperature @ Pout = 18 dBm Tone Output IP3 vs. Vdd @ Pout = 18 dBm Tone Power Compression @ 4 GHz Power Compression @ 10 GHz Power Compression @ 20 GHz Power Dissipation Second Harmonics vs. Temperature @ Pout = 18 dBm Second Harmonics vs. Vdd @ Pout = 18 dBm Second Harmonics vs. Pout Reverse Isolation vs Temperature Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Die Packaging Information Pad Descriptions Assembly Diagram Application Circuit