Datasheet HMC1114 (Analog Devices) - 5
| Hersteller | Analog Devices |
| Beschreibung | 10 W, GaN Power Amplifier, 2.7 GHz to 3.8 GHz |
| Seiten / Seite | 15 / 5 — Data Sheet. HMC1114. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. ND ND. … |
| Revision | A |
| Dateiformat / Größe | PDF / 320 Kb |
| Dokumentensprache | Englisch |
Data Sheet. HMC1114. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. ND ND. G G V DD1 G G V DD2 V DD2 G 32 31 30 29 28 27 26 25
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Data Sheet HMC1114 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS ND ND ND ND ND G G V DD1 G G V DD2 V DD2 G 32 31 30 29 28 27 26 25 GND 1 24 GND GND 2 23 GND GND 3 22 GND RFIN 4 HMC1114 21 RFOUT RFIN 5 TOP VIEW 20 RFOUT (Not to Scale) GND 6 19 GND GND 7 18 GND GND 8 17 GND 9 10 11 12 13 14 15 16 ND ND ND ND ND ND G V GG1 G G V GG2 G G G NOTES
002
1. EXPOSED PAD. EXPOSED PAD MUST BE CONNECTED TO RF/DC GROUND.
13530- Figure 2. Pin Configuration
Table 5. Pin Function Descriptions Pin No. Mnemonic Description
1 to 3, 6 to 9, 11, 12, 14 to GND Ground. These pins and the package bottom (EPAD) must be connected to RF/dc ground. See 19, 22 to 25, 28, 29, 31, 32 Figure 3 for the GND interface schematic. 4, 5 RFIN RF Input. These pins are dc-coupled and matched to 50 Ω. See Figure 4 for the RFIN interface schematic. 10, 13 VGG1, VGG2 Gate Control Voltage Pins. External bypass capacitors of 1 μF and 10 μF are required. See Figure 5 for the VGG1 and VGG2 interface schematic. 20, 21 RFOUT RF Output. These pins are ac-coupled and matched to 50 Ω. See Figure 6 for the RFOUT interface schematic. 26, 27, 30 VDD1, VDD2 Drain Bias Pins for the Amplifier. External bypass capacitors of 100 pF, 1 μF, and 10 μF are required. See Figure 7 for the VDD1 and VDD2 interface schematic. EPAD Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS GND
003
RFOUT
006 13530- 13530- Figure 3. GND Interface Figure 6. RFOUT Interface
VDD1, VDD2 RFIN
007 004 13530- 13530- Figure 4. RFIN Interface Figure 7. VDD1 and VDD2 Interface
V GG1, VGG2
005 13530- Figure 5. VGG1 and VGG2 Interface Rev. A | Page 5 of 15 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS TOTAL SUPPLY CURRENT BY VDD ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCE During Power-Up During Power-Down TYPICAL APPLICATION CIRCUIT EVALUATION PRINTED CIRCUIT BOARD (PCB) BILL OF MATERIALS OUTLINE DIMENSIONS ORDERING GUIDE
Data Sheet HMC1114 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS ND ND ND ND ND G G V DD1 G G V DD2 V DD2 G 32 31 30 29 28 27 26 25 GND 1 24 GND GND 2 23 GND GND 3 22 GND RFIN 4 HMC1114 21 RFOUT RFIN 5 TOP VIEW 20 RFOUT (Not to Scale) GND 6 19 GND GND 7 18 GND GND 8 17 GND 9 10 11 12 13 14 15 16 ND ND ND ND ND ND G V GG1 G G V GG2 G G G NOTES
002
1. EXPOSED PAD. EXPOSED PAD MUST BE CONNECTED TO RF/DC GROUND.
13530- Figure 2. Pin Configuration
Table 5. Pin Function Descriptions Pin No. Mnemonic Description
1 to 3, 6 to 9, 11, 12, 14 to GND Ground. These pins and the package bottom (EPAD) must be connected to RF/dc ground. See 19, 22 to 25, 28, 29, 31, 32 Figure 3 for the GND interface schematic. 4, 5 RFIN RF Input. These pins are dc-coupled and matched to 50 Ω. See Figure 4 for the RFIN interface schematic. 10, 13 VGG1, VGG2 Gate Control Voltage Pins. External bypass capacitors of 1 μF and 10 μF are required. See Figure 5 for the VGG1 and VGG2 interface schematic. 20, 21 RFOUT RF Output. These pins are ac-coupled and matched to 50 Ω. See Figure 6 for the RFOUT interface schematic. 26, 27, 30 VDD1, VDD2 Drain Bias Pins for the Amplifier. External bypass capacitors of 100 pF, 1 μF, and 10 μF are required. See Figure 7 for the VDD1 and VDD2 interface schematic. EPAD Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS GND
003
RFOUT
006 13530- 13530- Figure 3. GND Interface Figure 6. RFOUT Interface
VDD1, VDD2 RFIN
007 004 13530- 13530- Figure 4. RFIN Interface Figure 7. VDD1 and VDD2 Interface
V GG1, VGG2
005 13530- Figure 5. VGG1 and VGG2 Interface Rev. A | Page 5 of 15 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL SPECIFICATIONS TOTAL SUPPLY CURRENT BY VDD ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCE During Power-Up During Power-Down TYPICAL APPLICATION CIRCUIT EVALUATION PRINTED CIRCUIT BOARD (PCB) BILL OF MATERIALS OUTLINE DIMENSIONS ORDERING GUIDE