Datasheet HMC7885 (Analog Devices) - 5

HerstellerAnalog Devices
Beschreibung2 GHz to 6 GHz, 45 dBm Power Amplifier
Seiten / Seite11 / 5 — Data Sheet. HMC7885. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. VG1 …
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DokumentenspracheEnglisch

Data Sheet. HMC7885. PIN CONFIGURATION AND FUNCTION DESCRIPTIONS. VG1 (1). (18) NIC. GNDDC (2). (17) VDD1. VG1 (3). (16) GNDDC

Data Sheet HMC7885 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS VG1 (1) (18) NIC GNDDC (2) (17) VDD1 VG1 (3) (16) GNDDC

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Data Sheet HMC7885 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS VG1 (1) (18) NIC GNDDC (2) (17) VDD1 VG1 (3) (16) GNDDC GNDRFIN (4) (15) GNDRFOUT RFIN (5) HMC7885FH18 (14) RFOUT GNDRFIN (6) (13) GNDRFOUT VG2 (7) (12) NIC GNDDC (8) (11) VDD2 VG2 (9) (10) GNDDC NOTES
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1. THE PACKAGE BASE MUST BE MOUNTED TO A SUITABLE HEAT SINK FOR THE RF AND DC GROUND. IT IS RECOMMENDED TO USE 0-80 SOCKET CAP SCREWS.
12967- Figure 2. Pin Configuration
Table 3. Pin Function Descriptions Pin No. Mnemonic Description
1 VG1 Supply Voltage for MMIC 1 Gates. This pin is typically −1.3 V dc. Pin 1 is connected internally to Pin 3. 2 GNDDC Power Supply Ground. 3 VG1 Supply Voltage for MMIC 1 Gates. This pin is typically −1.3 V dc. Pin 3 is connected internally to Pin 1. 4 GNDRFIN RF Input Ground. 5 RFIN RF Input. This pin is dc-coupled and matched to 50 Ω. 6 GNDRFIN RF Input Ground. 7 VG2 Supply Voltage for MMIC 2 Gates. This pin is typically −1.3 V dc. Pin 7 is connected internally to Pin 9. 8 GNDDC Power Supply Ground. 9 VG2 Supply Voltage for MMIC 2 Gates. This pin is typically −1.3 V dc. Pin 9 is connected internally to Pin 7. 10 GNDDC Power Supply Ground. 11 VDD2 Supply Voltage for MMIC 2 Drains. 12 NIC Not Internally Connected. However, this pin can be connected externally to the RF and/or dc ground. 13 GNDRFOUT RF Output Ground. 14 RFOUT RF Output. This pin is ac-coupled and matched to 50 Ω. 15 GNDRFOUT RF Output Ground. 16 GNDDC Power Supply Ground. 17 VDD1 Supply Voltage for MMIC 1 Drains. 18 NIC Not Internally Connected. However, this pin can be connected externally to the RF and/or dc ground. Package Base GND The package base must be mounted to a suitable heat sink for the RF and dc ground. It is recommended to use 0-80 socket cap screws. Rev. 0 | Page 5 of 11 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS INFORMATION EVALUATION BOARD ASSEMBLY BILL OF MATERIALS OUTLINE DIMENSIONS ORDERING GUIDE