Datasheet HMC994A (Analog Devices) - 10
| Hersteller | Analog Devices |
| Beschreibung | GaAs pHEMT MMIC 0.5 WATT POWER AMPLIFIER, DC - 30 GHz |
| Seiten / Seite | 14 / 10 — HMC994A. GaAs pHEMT MMIC. 0.5 WATT POWER AMPLIFIER, DC - 30 GHz. Absolute … |
| Dateiformat / Größe | PDF / 848 Kb |
| Dokumentensprache | Englisch |
HMC994A. GaAs pHEMT MMIC. 0.5 WATT POWER AMPLIFIER, DC - 30 GHz. Absolute Maximum Ratings. Reliabilty Information
Modelllinie für dieses Datenblatt
Textversion des Dokuments
HMC994A
v04.0918
GaAs pHEMT MMIC 0.5 WATT POWER AMPLIFIER, DC - 30 GHz Absolute Maximum Ratings Reliabilty Information
Drain Bias Voltage (Vdd) 12V Channel Temperature to Maintain 175 °C 1 Million Hour MTTF Gate Bias Voltage (Vgg1) -3 to 0 Vdc Thermal Resistance 24.8 °C/W IP Gate Bias Voltage (Vgg2) 2.5V min up to (Vdd - 5.5V) (channel to die bottom) H RF Input Power (RFIN) 25 dBm Output Load VSWR 7:1 Continuous Pdiss (T= 85 °C) Stresses at or above those listed in the Absolute Maximum 3.62 W (derate 40.3 mW/°C above 85 °C) Ratings may cause permanent damage to the product. This R - C Storage Temperature -65 to 150 °C is a stress rating only, functional operation of the product E Operating Temperature -55 to 85 °C at these or any other conditions above those indicated in W ESD Sensitivity (HBM) Class 0B - Passed 150V the operational section of this specification is not implied. O Operation beyond the maximum operating condition for extended periods may affect product reliability. R & P ELECTROSTATIC SENSITIVE DEVICE
Outline Drawing
A OBSERVE HANDLING PRECAUTIONS E IN S - L R IE LIF P M A
Die Packaging Information
[1] NOTES: 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] Standard Alternate 2. DIE THICKNESS IS 0.004 (0.100) GP-1 (Gel Pack) [2] 3. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE 4. BOND PAD METALIZATION: GOLD [1] Refer to the “Packaging Information” section on our 5. BACKSIDE METALLIZATION: GOLD website for die packaging dimensions. 6. BACKSIDE METAL IS GROUND [2] For alternate packaging information contact Analog 7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS Devices Inc. 8. OVERALL DIE SIZE IS ±.002 For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
10
Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Performance Characteristics Gain & Return Loss Input Return Loss vs. Temperature Second Harmonics vs. Temperature @ Pout = 14 dBm, Vdd = 10V & Vgg = 3.5V, 175 mA Absolute Maximum Ratings Pad Descriptions Assembly Diagram Application Circuit
v04.0918
GaAs pHEMT MMIC 0.5 WATT POWER AMPLIFIER, DC - 30 GHz Absolute Maximum Ratings Reliabilty Information
Drain Bias Voltage (Vdd) 12V Channel Temperature to Maintain 175 °C 1 Million Hour MTTF Gate Bias Voltage (Vgg1) -3 to 0 Vdc Thermal Resistance 24.8 °C/W IP Gate Bias Voltage (Vgg2) 2.5V min up to (Vdd - 5.5V) (channel to die bottom) H RF Input Power (RFIN) 25 dBm Output Load VSWR 7:1 Continuous Pdiss (T= 85 °C) Stresses at or above those listed in the Absolute Maximum 3.62 W (derate 40.3 mW/°C above 85 °C) Ratings may cause permanent damage to the product. This R - C Storage Temperature -65 to 150 °C is a stress rating only, functional operation of the product E Operating Temperature -55 to 85 °C at these or any other conditions above those indicated in W ESD Sensitivity (HBM) Class 0B - Passed 150V the operational section of this specification is not implied. O Operation beyond the maximum operating condition for extended periods may affect product reliability. R & P ELECTROSTATIC SENSITIVE DEVICE
Outline Drawing
A OBSERVE HANDLING PRECAUTIONS E IN S - L R IE LIF P M A
Die Packaging Information
[1] NOTES: 1. ALL DIMENSIONS IN INCHES [MILLIMETERS] Standard Alternate 2. DIE THICKNESS IS 0.004 (0.100) GP-1 (Gel Pack) [2] 3. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE 4. BOND PAD METALIZATION: GOLD [1] Refer to the “Packaging Information” section on our 5. BACKSIDE METALLIZATION: GOLD website for die packaging dimensions. 6. BACKSIDE METAL IS GROUND [2] For alternate packaging information contact Analog 7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS Devices Inc. 8. OVERALL DIE SIZE IS ±.002 For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
10
Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Performance Characteristics Gain & Return Loss Input Return Loss vs. Temperature Second Harmonics vs. Temperature @ Pout = 14 dBm, Vdd = 10V & Vgg = 3.5V, 175 mA Absolute Maximum Ratings Pad Descriptions Assembly Diagram Application Circuit