Datasheet ADPA7005CHIP (Analog Devices) - 7
| Hersteller | Analog Devices |
| Beschreibung | GaAs, pHEMT, MMIC,1 W Power Amplifier, 20 GHz to 44 GHz |
| Seiten / Seite | 23 / 7 — Data Sheet. ADPA7005CHIP. TYPICAL PERFORMANCE CHARACTERISTIC. +85°C. … |
| Dateiformat / Größe | PDF / 522 Kb |
| Dokumentensprache | Englisch |
Data Sheet. ADPA7005CHIP. TYPICAL PERFORMANCE CHARACTERISTIC. +85°C. +25°C. –55°C. d ( S. URN L T. S11. N (. S21. AI G. S22. –10. N AND RE. –15. –20. –25
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Data Sheet ADPA7005CHIP TYPICAL PERFORMANCE CHARACTERISTIC 20 20 +85°C 15 +25°C 18 –55°C B) 10 d ( S 16 S 5 O 0 B) 14 d URN L T S11 N ( –5 S21 AI G 12 S22 –10 N AND RE 10 AI G –15 8 –20 –25 6 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48
010
20 22 24 26 28 30 32 34 36 38 40 42 44
013
FREQUENCY (GHz)
17319-
FREQUENCY (GHz)
17319- Figure 10. Gain and Return Loss vs. Frequency, VDD = 5 V, IDQ = 1200 mA Figure 13. Gain vs. Frequency for Various Temperatures, VDD = 5 V, IDQ = 1200 mA
20 20 18 18 16 16 14 B) B) 14 d d N ( 12 N ( AI AI G G 12 10 10 8 6 8 1600mA 4V 1400mA 5V 1200mA 4
1
6
1
20 22 24 26 28 30 32 34 36 38 40 42 44
0
20 22 24 26 28 30 32 34 36 38 40 42 44
014
FREQUENCY (GHz)
17319-
FREQUENCY (GHz)
17319- Figure 11. Gain vs. Frequency for Various VDD, IDQ = 1200 mA Figure 14. Gain vs. Frequency for Various IDQ, VDD = 5 V
0 0 +85°C +25°C –55°C –5 –5 B) B) d d ( ( S S –10 S S O –10 O –15 URN L URN L T T –15 RE RE UT UT –20 INP INP –20 –25 4V 5V –25 –30 20 22 24 26 28 30 32 34 36 38 40 42 44
012
20 22 24 26 28 30 32 34 36 38 40 42 44
015
FREQUENCY (GHz)
17319-
FREQUENCY (GHz)
17319- Figure 12. Input Return Loss vs. Frequency for Various Temperatures, Figure 15. Input Return Loss vs. Frequency for Various VDD, IDQ = 1200 mA VDD = 5 V, IDQ = 1200 mA Rev. 0 | Page 7 of 23 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 34 GHz FREQUENCY RANGE 34 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTIC CONSTANT IDD OPERATION THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding BIASING ADPA7005CHIP WITH THE HMC980LP4E APPLICATION CIRCUIT SETUP LIMITING VGATE FOR ADPA7005CHIP VGGx ABSOLUTE MAXIMUM RATING REQUIREMENT HMC980LP4E BIAS SEQUENCE Power-Up Sequence Power-Down Sequence CONSTANT DRAIN CURRENT BIASING vs. CONSTANT GATE VOLTAGE BIASING TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
010
20 22 24 26 28 30 32 34 36 38 40 42 44
013
FREQUENCY (GHz)
17319-
FREQUENCY (GHz)
17319- Figure 10. Gain and Return Loss vs. Frequency, VDD = 5 V, IDQ = 1200 mA Figure 13. Gain vs. Frequency for Various Temperatures, VDD = 5 V, IDQ = 1200 mA
20 20 18 18 16 16 14 B) B) 14 d d N ( 12 N ( AI AI G G 12 10 10 8 6 8 1600mA 4V 1400mA 5V 1200mA 4
1
6
1
20 22 24 26 28 30 32 34 36 38 40 42 44
0
20 22 24 26 28 30 32 34 36 38 40 42 44
014
FREQUENCY (GHz)
17319-
FREQUENCY (GHz)
17319- Figure 11. Gain vs. Frequency for Various VDD, IDQ = 1200 mA Figure 14. Gain vs. Frequency for Various IDQ, VDD = 5 V
0 0 +85°C +25°C –55°C –5 –5 B) B) d d ( ( S S –10 S S O –10 O –15 URN L URN L T T –15 RE RE UT UT –20 INP INP –20 –25 4V 5V –25 –30 20 22 24 26 28 30 32 34 36 38 40 42 44
012
20 22 24 26 28 30 32 34 36 38 40 42 44
015
FREQUENCY (GHz)
17319-
FREQUENCY (GHz)
17319- Figure 12. Input Return Loss vs. Frequency for Various Temperatures, Figure 15. Input Return Loss vs. Frequency for Various VDD, IDQ = 1200 mA VDD = 5 V, IDQ = 1200 mA Rev. 0 | Page 7 of 23 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 34 GHz FREQUENCY RANGE 34 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTIC CONSTANT IDD OPERATION THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions Mounting Wire Bonding BIASING ADPA7005CHIP WITH THE HMC980LP4E APPLICATION CIRCUIT SETUP LIMITING VGATE FOR ADPA7005CHIP VGGx ABSOLUTE MAXIMUM RATING REQUIREMENT HMC980LP4E BIAS SEQUENCE Power-Up Sequence Power-Down Sequence CONSTANT DRAIN CURRENT BIASING vs. CONSTANT GATE VOLTAGE BIASING TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE