Datasheet HMC463LH250 (Analog Devices) - 6

HMC463LH250
v06.1217
GaAs pHEMT MMIC LOW NOISE AGC AMPLIFIER, 2 - 20 GHz Evaluation PCB
T M E - S IS O W N O S - L R IE LIF P M A
List of Materials for Evaluation PCB 111709 [1]
The circuit board used in the application should use Item Description RF circuit design techniques. Signal lines should J1 - J2 SRI K Connector have 50 Ohm impedance while the package ground J3 - J4 2 mm Molex Header leads and package bottom should be connected C1 - C3 100 pF Capacitor, 0402 Pkg. directly to the ground plane similar to that shown. C4 - C6 1000 pF Capacitor, 0603 Pkg. A sufficient number of via holes should be used C7 - C9 4.7 µF Capacitor, Tantalum to connect the top and bottom ground planes. U1 HMC463LH250 The evaluation board should be mounted to an PCB [2] 111707 Evaluation PCB appropriate heat sink. The evaluation circuit [1] Reference this number when ordering complete evaluation PCB board shown is available from Analog Devices [2] Circuit Board Material: Rogers 4350 upon request. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
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