Datasheet HMC516LC5 (Analog Devices) - 4
| Hersteller | Analog Devices |
| Beschreibung | SMT PHEMT LOW NOISE AMPLIFIER, 9 - 18 GHz |
| Seiten / Seite | 6 / 4 — HMC516LC5. SMT PHEMT LOW NOISE. AMPLIFIER, 9 - 18 GHz. Absolute Maximum … |
| Dateiformat / Größe | PDF / 944 Kb |
| Dokumentensprache | Englisch |
HMC516LC5. SMT PHEMT LOW NOISE. AMPLIFIER, 9 - 18 GHz. Absolute Maximum Ratings. Typical Supply Current vs. Vdd. Outline Drawing
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Textversion des Dokuments
HMC516LC5
v05.0717
SMT PHEMT LOW NOISE AMPLIFIER, 9 - 18 GHz Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd1, Vdd2, Vdd3) +4 Vdc Vdd (V) Idd (mA) RF Input Power (RFIN)(Vdd = +3.0 Vdc) +5 dBm +2.5 61 T Channel Temperature 175 °C +3.0 65 M Continuous Pdiss (T= 85 °C) +3.5 69 1.17 W (derate 14 mW/°C above 85 °C) Note: Amplifier will operate over full voltage range shown Thermal Resistance above. 76.9 °C/W (channel to die bottom) S - S Storage Temperature -65 to +150 °C R Operating Temperature -40 to +85 °C ELECTROSTATIC SENSITIVE DEVICE IE ESD Sensitivity (HBM) Class 1A OBSERVE HANDLING PRECAUTIONS LIF P M
Outline Drawing
E A IS O W N LO NOTES: 1. PACKAGE BODY MATERIAL: ALUMINA 2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL 3. DIMENSIONS ARE IN INCHES [MILLIMETERS] 4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC516LC5 Alumina, White Gold over Nickel MSL3 [1] H516 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
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v05.0717
SMT PHEMT LOW NOISE AMPLIFIER, 9 - 18 GHz Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd1, Vdd2, Vdd3) +4 Vdc Vdd (V) Idd (mA) RF Input Power (RFIN)(Vdd = +3.0 Vdc) +5 dBm +2.5 61 T Channel Temperature 175 °C +3.0 65 M Continuous Pdiss (T= 85 °C) +3.5 69 1.17 W (derate 14 mW/°C above 85 °C) Note: Amplifier will operate over full voltage range shown Thermal Resistance above. 76.9 °C/W (channel to die bottom) S - S Storage Temperature -65 to +150 °C R Operating Temperature -40 to +85 °C ELECTROSTATIC SENSITIVE DEVICE IE ESD Sensitivity (HBM) Class 1A OBSERVE HANDLING PRECAUTIONS LIF P M
Outline Drawing
E A IS O W N LO NOTES: 1. PACKAGE BODY MATERIAL: ALUMINA 2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES GOLD OVER 50 MICROINCHES MINIMUM NICKEL 3. DIMENSIONS ARE IN INCHES [MILLIMETERS] 4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC516LC5 Alumina, White Gold over Nickel MSL3 [1] H516 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
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