Datasheet HMC-ALH444 (Analog Devices) - 3
| Hersteller | Analog Devices |
| Beschreibung | GaAs HEMT MMIC LOW NOISE AMPLIFIER, 1 - 12 GHz |
| Seiten / Seite | 6 / 3 — HMC-ALH444. GaAs HEMT MMIC LOW NOISE. AMPLIFIER, 1 - 12 GHz. Absolute … |
| Dateiformat / Größe | PDF / 518 Kb |
| Dokumentensprache | Englisch |
HMC-ALH444. GaAs HEMT MMIC LOW NOISE. AMPLIFIER, 1 - 12 GHz. Absolute Maximum Ratings. Outline Drawing. Die Packaging Information
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Textversion des Dokuments
HMC-ALH444
v04.0417
GaAs HEMT MMIC LOW NOISE AMPLIFIER, 1 - 12 GHz
1
Absolute Maximum Ratings
Drain Bias Voltage +5.5 Vdc IP ELECTROSTATIC SENSITIVE DEVICE RF Input Power 12 dBm H OBSERVE HANDLING PRECAUTIONS Gate Bias Voltage Vgg1 -1 to 0.3 Vdc Gate Bias Voltage Vgg2 0 to 2.5 Vdc Thermal Resistance E - C 109 °C/W (channel to die bottom) IS Channel Temperature 180 °C O Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C ESD Rating Class 0 W N O
Outline Drawing
S - L R IE LIF P M A
Die Packaging Information
[1] NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM]. Standard Alternate 2. TYPICAL BOND PAD IS .004” SQUARE. 3. BACKSIDE METALLIZATION: GOLD. GP-1 (Gel Pack) [2] 4. BACKSIDE METAL IS GROUND. [1] Refer to the “Packaging Information” section for die 5. BOND PAD METALLIZATION: GOLD. packaging dimensions. 6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. [2] For alternate packaging information contact Hittite 7. OVERALL DIE SIZE ±.002” Microwave Corporation. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
1 - 3
Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
v04.0417
GaAs HEMT MMIC LOW NOISE AMPLIFIER, 1 - 12 GHz
1
Absolute Maximum Ratings
Drain Bias Voltage +5.5 Vdc IP ELECTROSTATIC SENSITIVE DEVICE RF Input Power 12 dBm H OBSERVE HANDLING PRECAUTIONS Gate Bias Voltage Vgg1 -1 to 0.3 Vdc Gate Bias Voltage Vgg2 0 to 2.5 Vdc Thermal Resistance E - C 109 °C/W (channel to die bottom) IS Channel Temperature 180 °C O Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C ESD Rating Class 0 W N O
Outline Drawing
S - L R IE LIF P M A
Die Packaging Information
[1] NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM]. Standard Alternate 2. TYPICAL BOND PAD IS .004” SQUARE. 3. BACKSIDE METALLIZATION: GOLD. GP-1 (Gel Pack) [2] 4. BACKSIDE METAL IS GROUND. [1] Refer to the “Packaging Information” section for die 5. BOND PAD METALLIZATION: GOLD. packaging dimensions. 6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. [2] For alternate packaging information contact Hittite 7. OVERALL DIE SIZE ±.002” Microwave Corporation. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
1 - 3
Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D