Datasheet HMC599ST89, 599ST89E (Analog Devices) - 6
| Hersteller | Analog Devices |
| Beschreibung | GaAs pHEMT MMIC LNA, 75 Ohm 50 - 1000 MHz |
| Seiten / Seite | 8 / 6 — HMC599ST89 / 599ST89E. GaAs pHEMT MMIC LNA, 75 Ohm. 50 - 1000 MHz. … |
| Dateiformat / Größe | PDF / 525 Kb |
| Dokumentensprache | Englisch |
HMC599ST89 / 599ST89E. GaAs pHEMT MMIC LNA, 75 Ohm. 50 - 1000 MHz. Absolute Maximum Ratings. Typical Supply Current vs. Vdd
Modelllinie für dieses Datenblatt
Textversion des Dokuments
HMC599ST89 / 599ST89E
v02.0311
GaAs pHEMT MMIC LNA, 75 Ohm 50 - 1000 MHz
7
Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd) +6 Vdc Vdd (Vdc) idd (mA) rf input power (rfiN) +10 dBm +5 120 T Channel Temperature 175 °C +3 120 m Continuous pdiss (T = 85 °C) s 0.89 w (derate 9.84 mw/°C above 85 °C) Thermal resistance 101.67 °C/w e - (junction to ground paddle) ELECTROSTATIC SENSITIVE DEVICE storage Temperature -65 to +150 °C OBSERVE HANDLING PRECAUTIONS is operating Temperature -40 to +85 °C o w N lo
Outline Drawing
s - r ie lif p m A NoTes: 1. PACKAGE BODY MATERIAL: MOLDING COMPOUND MP-180S OR EQUIVALENT. 2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING. 3. LEAD PLATING: 100% MATTE TIN. 4. DIMENSIONS ARE IN INCHES [MILLIMETERS] 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15 mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25 mm PER SIDE. 7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
part Number package Body material lead finish msl rating package marking [3] HmC599sT89 low stress injection molded plastic sn/pb solder msl1 [1] H599 XXXX HmC599sT89e roHs-compliant low stress injection molded plastic 100% matte sn msl1 [2] H599 XXXX [1] max peak reflow temperature of 235 °C [2] max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX Inf F or o m rat ip o r n ifc ur e n ,is hd e e d lbiv y e Anry alo a g n D d evi cto es ips la beclie ev eo d rtd o e b r e sa: ccH ur iattte itaen M d reliic a r bl o e w . H a o v weev eC r, o n r o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other poration, 20 Alpha Road, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 rights of third parties that may result from its use. Specifications subject to change without notice. No Or P d hoe n r e O : 7 n- 81-li 3 n 2 e 9- a 4 t 7 0 www 0 • O . rdh e itt r o it n e li . n co e a m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. t www.analog.com
7 - 6
Application Support: Phon Trademarks and registered trademarks are the property of their respective owners. e: 978-250-334 A 3 p p liocra t ia o pp n S s u @ p h por ittti : Pte. ho c n o e m : 1-800-ANALOG-D
v02.0311
GaAs pHEMT MMIC LNA, 75 Ohm 50 - 1000 MHz
7
Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd) +6 Vdc Vdd (Vdc) idd (mA) rf input power (rfiN) +10 dBm +5 120 T Channel Temperature 175 °C +3 120 m Continuous pdiss (T = 85 °C) s 0.89 w (derate 9.84 mw/°C above 85 °C) Thermal resistance 101.67 °C/w e - (junction to ground paddle) ELECTROSTATIC SENSITIVE DEVICE storage Temperature -65 to +150 °C OBSERVE HANDLING PRECAUTIONS is operating Temperature -40 to +85 °C o w N lo
Outline Drawing
s - r ie lif p m A NoTes: 1. PACKAGE BODY MATERIAL: MOLDING COMPOUND MP-180S OR EQUIVALENT. 2. LEAD MATERIAL: Cu w/ Ag SPOT PLATING. 3. LEAD PLATING: 100% MATTE TIN. 4. DIMENSIONS ARE IN INCHES [MILLIMETERS] 5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15 mm PER SIDE. 6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25 mm PER SIDE. 7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
part Number package Body material lead finish msl rating package marking [3] HmC599sT89 low stress injection molded plastic sn/pb solder msl1 [1] H599 XXXX HmC599sT89e roHs-compliant low stress injection molded plastic 100% matte sn msl1 [2] H599 XXXX [1] max peak reflow temperature of 235 °C [2] max peak reflow temperature of 260 °C [3] 4-Digit lot number XXXX Inf F or o m rat ip o r n ifc ur e n ,is hd e e d lbiv y e Anry alo a g n D d evi cto es ips la beclie ev eo d rtd o e b r e sa: ccH ur iattte itaen M d reliic a r bl o e w . H a o v weev eC r, o n r o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other poration, 20 Alpha Road, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 rights of third parties that may result from its use. Specifications subject to change without notice. No Or P d hoe n r e O : 7 n- 81-li 3 n 2 e 9- a 4 t 7 0 www 0 • O . rdh e itt r o it n e li . n co e a m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. t www.analog.com
7 - 6
Application Support: Phon Trademarks and registered trademarks are the property of their respective owners. e: 978-250-334 A 3 p p liocra t ia o pp n S s u @ p h por ittti : Pte. ho c n o e m : 1-800-ANALOG-D