Datasheet HMC752LC4 (Analog Devices) - 5
| Hersteller | Analog Devices |
| Beschreibung | GaAs HEMT MMIC LOW NOISE AMPLIFIER, 24 - 28 GHz |
| Seiten / Seite | 7 / 5 — HMC752LC4. GaAs HEMT MMIC LOW NOISE. AMPLIFIER, 24 - 28 GHz. Outline … |
| Dateiformat / Größe | PDF / 1.1 Mb |
| Dokumentensprache | Englisch |
HMC752LC4. GaAs HEMT MMIC LOW NOISE. AMPLIFIER, 24 - 28 GHz. Outline Drawing. 24-Terminal Ceramic Leadless Chip Carrier [LCC]
Modelllinie für dieses Datenblatt
Textversion des Dokuments
HMC752LC4
v02.0618
GaAs HEMT MMIC LOW NOISE AMPLIFIER, 24 - 28 GHz Outline Drawing 24-Terminal Ceramic Leadless Chip Carrier [LCC] (E-24-1) Dimensions shown in millimeters.
T M
4.05 0.36 3.90 SQ
E - S
0.30 PIN 1 3.75 0.08 0.24 INDICATOR
IS
BSC PIN 1 19 24 18 1
O
0.50 BSC 2.60 EXPOSED PAD 2.50 SQ
W N
2.40
O
13 6 12 7 TOP VIEW 0.32 BOTTOM VIEW BSC
S - L
2.50 REF 1.00
R
3.10 BSC 0.90 SIDE VIEW
IE
0.80 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND SEATING
LIF
FUNCTION DESCRIPTIONS PLANE SECTION OF THIS DATA SHEET.
P M A
PKG-004840 02-27-2017-B
24-Terminal Ceramic Leadless Chip Carrier [LCC] (E-24-1) Dimensions shown in millimeters.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC752LC4 Alumina, White Gold over Nickel MSL3 [1] H752 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
5
Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Gain, Noise Figure & P1dB vs. Supply Voltage @ 28 GHz Power Compression @ 28 GHz Reverse Isolation vs. Temperature Psat vs. Temperature P1dB vs. Temperature Output IP3 vs. Idd Output IP3 vs. Temperature Noise Figure vs. Idd Noise Figure vs. Temperature Output Return Loss vs. Temperature Input Return Loss vs. Temperature Gain vs. Idd Gain vs. Temperature P1dB vs. Idd Absolute Maximum Ratings
v02.0618
GaAs HEMT MMIC LOW NOISE AMPLIFIER, 24 - 28 GHz Outline Drawing 24-Terminal Ceramic Leadless Chip Carrier [LCC] (E-24-1) Dimensions shown in millimeters.
T M
4.05 0.36 3.90 SQ
E - S
0.30 PIN 1 3.75 0.08 0.24 INDICATOR
IS
BSC PIN 1 19 24 18 1
O
0.50 BSC 2.60 EXPOSED PAD 2.50 SQ
W N
2.40
O
13 6 12 7 TOP VIEW 0.32 BOTTOM VIEW BSC
S - L
2.50 REF 1.00
R
3.10 BSC 0.90 SIDE VIEW
IE
0.80 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND SEATING
LIF
FUNCTION DESCRIPTIONS PLANE SECTION OF THIS DATA SHEET.
P M A
PKG-004840 02-27-2017-B
24-Terminal Ceramic Leadless Chip Carrier [LCC] (E-24-1) Dimensions shown in millimeters.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [2] HMC752LC4 Alumina, White Gold over Nickel MSL3 [1] H752 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
5
Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Gain, Noise Figure & P1dB vs. Supply Voltage @ 28 GHz Power Compression @ 28 GHz Reverse Isolation vs. Temperature Psat vs. Temperature P1dB vs. Temperature Output IP3 vs. Idd Output IP3 vs. Temperature Noise Figure vs. Idd Noise Figure vs. Temperature Output Return Loss vs. Temperature Input Return Loss vs. Temperature Gain vs. Idd Gain vs. Temperature P1dB vs. Idd Absolute Maximum Ratings