Datasheet HMC903LP3E (Analog Devices) - 4

HMC903LP3E Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 3. Parameter Rating
Thermal performance is directly linked to printed circuit board Drain Bias Voltage 4.5 V (PCB) design and operating environment. Careful attention to RF Input Power 20 dBm PCB thermal design is required. Gate Bias Voltage
Table 4. Thermal Resistance
V −2 V to +0.2 V GG1
Package Type1 θ Unit JC
V −2 V to +0.2 V GG2 HCP-16-1 144.8 °C/W Continuous Power Dissipation, P (T = 0.45 W DISS A 85°C, Derate 6.9 mW/°C Above 85°C) 1 Thermal impedance simulated values are based on JEDEC 2s2p thermal test Channel Temperature 175°C board. See JEDEC JESD51. Maximum Peak Reflow Temperature 260°C
ESD CAUTION
Storage Temperature −65°C to +85°C Operating Temperature −40°C to +85°C ESD Sensitivity (Human Body Model) Class 0, Passed 150 V Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. I | Page 4 of 13 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications 6 GHz to 16 GHz Frequency Range 16 GHz to 17 GHz Frequency Range Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Recommended Bias Sequence During Power Up Recommended Bias Sequence During Power Down Evaluation PCB Typical Application Circuits Outline Dimensions Ordering Guide