Datasheet HMC1040CHIPS (Analog Devices) - 8
| Hersteller | Analog Devices |
| Beschreibung | 20 GHz to 44 GHz, GaAs, pHEMT, MMIC, Low Noise Amplifier |
| Seiten / Seite | 14 / 8 — HMC1040CHIPS. Data Sheet. 2.0V. +85°C. 2.5V. –10. +25°C. 3.0V. –55°C. … |
| Dateiformat / Größe | PDF / 351 Kb |
| Dokumentensprache | Englisch |
HMC1040CHIPS. Data Sheet. 2.0V. +85°C. 2.5V. –10. +25°C. 3.0V. –55°C. –15. –20. T A L. URN L. –25. –12. –30. SE I. UT P. –14. –35. EVER R. –16. –40. –18. –45. –50
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HMC1040CHIPS Data Sheet 0 0 –2 –5 2.0V +85°C –4 2.5V –10 +25°C B) 3.0V ) –55°C d B ( –6 S –15 (d S N O –8 IO –20 T A L URN L –10 –25 T SO RE –12 –30 SE I UT P –14 –35 UT EVER R O –16 –40 –18 –45 –20 –50 20 22 24 26 28 30 32 34 36 38 40 42 44
013
20 22 24 26 28 30 32 34 36 38 40 42 44
016
FREQUENCY (GHz)
16709-
FREQUENCY (GHz)
16709- Figure 13. Output Return Loss vs. Frequency for Various Supply Voltages Figure 16. Reverse Isolation vs. Frequency for Various Temperatures
10 10 +85°C 2.0V 8 +25°C 8 2.5V –55°C 3.0V ) ) dB dB ( 6 ( E 6 E R R FIGU FIGU E 4 E 4 OIS OIS N N 2 2 0 0 20 22 24 26 28 30 32 34 36 38 40 42 44
014
20 22 24 26 28 30 32 34 36 38 40 42 44
017
FREQUENCY (GHz)
16709-
FREQUENCY (GHz)
16709- Figure 14. Noise Figure vs. Frequency for Various Temperatures Figure 17. Noise Figure vs. Frequency for Various Supply Voltages
18 18 16 16 14 14 12 Bm) 12 Bm) d d ( B ( AT 1d 10 S 10 P P +85°C +85°C 8 +25°C 8 +25°C –55°C –55°C 6 6 4 4 20 22 24 26 28 30 32 34 36 38 40 42 44
015
20 22 24 26 28 30 32 34 36 38 40 42 44
018
FREQUENCY (GHz)
16709-
FREQUENCY (GHz)
16709- Figure 15. P1dB vs. Frequency for Various Temperatures Figure 18. PSAT vs. Frequency for Various Temperatures Rev. 0 | Page 8 of 14 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 24 GHz FREQUENCY RANGE 24 GHz TO 32 GHz FREQUENCY RANGE 32 GHz TO 40 GHz FREQUENCY RANGE 40 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
013
20 22 24 26 28 30 32 34 36 38 40 42 44
016
FREQUENCY (GHz)
16709-
FREQUENCY (GHz)
16709- Figure 13. Output Return Loss vs. Frequency for Various Supply Voltages Figure 16. Reverse Isolation vs. Frequency for Various Temperatures
10 10 +85°C 2.0V 8 +25°C 8 2.5V –55°C 3.0V ) ) dB dB ( 6 ( E 6 E R R FIGU FIGU E 4 E 4 OIS OIS N N 2 2 0 0 20 22 24 26 28 30 32 34 36 38 40 42 44
014
20 22 24 26 28 30 32 34 36 38 40 42 44
017
FREQUENCY (GHz)
16709-
FREQUENCY (GHz)
16709- Figure 14. Noise Figure vs. Frequency for Various Temperatures Figure 17. Noise Figure vs. Frequency for Various Supply Voltages
18 18 16 16 14 14 12 Bm) 12 Bm) d d ( B ( AT 1d 10 S 10 P P +85°C +85°C 8 +25°C 8 +25°C –55°C –55°C 6 6 4 4 20 22 24 26 28 30 32 34 36 38 40 42 44
015
20 22 24 26 28 30 32 34 36 38 40 42 44
018
FREQUENCY (GHz)
16709-
FREQUENCY (GHz)
16709- Figure 15. P1dB vs. Frequency for Various Temperatures Figure 18. PSAT vs. Frequency for Various Temperatures Rev. 0 | Page 8 of 14 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 24 GHz FREQUENCY RANGE 24 GHz TO 32 GHz FREQUENCY RANGE 32 GHz TO 40 GHz FREQUENCY RANGE 40 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS Handling Precautions TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE