HMC8400Data Sheet03028–526–1024B) d (–15S22S OBm)–20d203 (URN LIP18T–25RE16–2.0V–30–1.6V0V–1.4V+0.4V14–1.2V+1.0V–35–1.0V+1.6V12–1.2V–0.4V+0.4V+1.6V–0.8V+2.2V–0.8V–0.2V+0.8V+2.0V–0.4V+2.6V–0.6V0V+1.2V+2.4V–4010051015202530 034 26101418222630 037 FREQUENCY (GHz) 13852- FREQUENCY (GHz) 13852- Figure 26. Output Return Loss vs. Frequency at Various VGG2 Voltage Levels Figure 29. Output IP3 vs. Frequency at Various VGG2 Voltage Levels 2216–1.2V+0.4V20–0.8V+0.8V–0.6V+1.2V12–0.4V+1.6V18–0.2V+2.0V80V+2.4V164140Bm)B)12dd–4B (N (10AI1dGP–88–1264–162–200–2426101418222630 035 2.42.01.61.20.80.40–0.4 –0.8 –1.2 –1.62.0 040 FREQUENCY (GHz) 13852- VGG2 (V) 13852- Figure 27. P1dB vs. Frequency at Various VGG2 Voltage Levels Figure 30. Gain vs. VGG2 at 10 GHz 2230201826161422Bm)12dBm)(dAT103 (SPIP1886–1.2V+0.4V4–0.8V+0.8V14–0.6V+1.2V–0.4V+1.6V2–0.2V+2.0V0V+2.4V01026101418222630 036 2.42.01.61.20.80.40–0.4–0.8–1.2 041 FREQUENCY (GHz) 13852- VGG2 (V) 13852- Figure 28. PSAT vs. Frequency at Various VGG2 Voltage Levels Figure 31. Output IP3 vs. VGG2 at 10 GHz Rev. B | Page 10 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 6 GHz FREQUENCY RANGE 6 GHz TO 20 GHz FREQUENCY RANGE 20 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE